Film and mold release film

A technology of methyl and pentene, applied in the direction of synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problem of large thermal expansion coefficient of release film, wrinkles on the surface of release film, circuit and mold release Solve problems such as film voids, and achieve the effects of excellent heat resistance and mold release, improvement of poor appearance, and good tolerance

Active Publication Date: 2009-07-08
MITSUI CHEM INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The adhesive applied on the cover layer to cover parts other than the terminal part melts when bonded by heating and pressure, and often flows to the terminal part of the circuit to form a cover layer of the adhesive, causing problems such as poor electrical connections
In addition, the thermal expansion coefficient of the conventional release film is relatively large compared with the substrate, the cover layer, and the metal plate. Therefore, when the cover layer is bonded by heating and pressurizing, the surface of the release film may be damaged. wrinkle
Therefore, there will be the following problems:

Method used

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  • Film and mold release film
  • Film and mold release film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0164] Films were produced using a multi-manifold type extruder with a three-layer coextrusion T-die. Using the first extruder and the third extruder, (A1) 4-methyl-1-pentene copolymer (1-decene content: 2.4% by mass, MFR: 25g / 10 points, melting point: 233°C) plasticizing. In addition, (B1) propylene·1-butene copolymer (density: 0.89 g / cm 3 , MFR: 30g / 10 minutes, melting point: 110°C, Vicat softening temperature: 78°C, 1-butene content: 20mol%) plasticized.

[0165] With A1 as the layer (A) and B1 as the layer (B), the composite of layer (A) / layer (B) / layer (A) is performed in a co-extrusion T-die. Furthermore, while pulling (20 m / min) this composite compound with a roll, the multilayer film which consists of three layers was manufactured.

[0166]Then, the surface of the obtained multilayer film was embossed with two embossing rolls whose average roughness (Ra) was 25 micrometers. The roll temperature was 130°C, and the embossing speed was 20 m / min. The peripheral speed ...

Embodiment 2

[0171] In addition to using (B2) ethylene-ethyl acrylate copolymer (MFR: 27 g / 10 minutes, melting point: 90° C., Vicat softening temperature: 70° C., ethyl acrylate content: 15 mol %) instead of B1, in addition, press The conditions shown in Table 1 were the same as in Example 1 to produce a multilayer film.

[0172] Then, the multilayer film was heated and pressed under the same conditions as in Example 1 to bond the overcoat layer to the surface of the circuit formed on the substrate.

[0173] Evaluation was performed in the same manner as in Example 1, and the evaluation results are shown in Table 1.

Embodiment 3

[0175] Use (B3) propylene·1-butene·4-methyl-1-pentene copolymer (propylene content: 36 mol%, 1-butene content 14 mol%, 4-methyl-1-pentene content: 50 mol%, density: 0.880g / cm 3 , MFR: 27g / 10 minutes, Vicat softening temperature: 80°C) 50% by mass and linear low-density polyethylene (density: 0.92g / cm 3 , MFR: 15g / 10 minutes, Vicat softening temperature: 100°C) 50 mass% blend (MFR: 20g / 10 minutes, Vicat softening temperature: 85°C) instead of B1, in addition, according to Table 1 The conditions shown and the same procedure as in Example 1 produced a multilayer film.

[0176] Then, the multilayer film was heated and pressed under the same conditions as in Example 1 to bond the overcoat layer to the surface of the circuit formed on the substrate.

[0177] Evaluation was performed in the same manner as in Example 1, and the evaluation results are shown in Table 1.

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Abstract

A film that has a layer of specified 4-methyl-1-pentene copolymer and has a specified thickness buildup and thermal shrinkage coefficient. There is provided a film excelling in heat resistance and mold release properties, especially a film suitable for use as a mold release film applied in producing of a laminate according to pressure molding. When this film is used as a mold release film in the heating and pressurization steps for manufacturing of flexible printed boards, there can be prevented sticking of coverlay to metal sheet and outflow of adhesive leading to sticking to other members. Moreover, there can be avoided generation of voids in non-printed portions on the board, and contamination of exposed portions, such as terminal portions, of electric circuit by melting outflow of adhesive. Still further, wrinkling of the mold release film can be avoided, so that generation of voids due to follow failure of the mold release film can be avoided and that thus flexible printed boards with good appearance can be obtained.

Description

technical field [0001] The present invention relates to a film comprising a layer formed of a 4-methyl-1-pentene copolymer and having excellent heat resistance and mold release properties, and is suitable for producing a film or sheet-like laminate by press molding Release film used. More specifically, the present invention relates to a flexible printed circuit board (hereinafter also referred to as "FPC") on which a circuit (copper foil) is formed on the surface, using an adhesive and applying heat and pressure to bond as a A release film used as an overcoat for a protective layer. Background technique [0002] When a laminate is produced by sandwiching a plurality of raw films or sheets between metal plates and the like, a release film is generally required to prevent the metal plates and the resulting laminate from sticking. In addition, since pressure molding is often accompanied by heating, the release film is required to have high heat resistance and excellent mold r...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08F210/14B32B27/32
CPCH05K3/281C08F210/14B32B27/32
Inventor 谷崎达也
Owner MITSUI CHEM INC
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