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Tungsten copper connection method

A connection method, tungsten-copper technology, applied in the direction of connection, connection contact materials, electrical components, etc., can solve the problems of limited application and complicated preparation process, and achieve the effect of simple process operation, good connection effect and low cost

Inactive Publication Date: 2009-07-29
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation process of tungsten copper FGM materials is relatively complicated, and the application is still very limited.

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0023] Industrial pure tungsten is connected with CuCrZr alloy, and the sample size is 30mm×30mm×5mm and 30mm×30mm×30mm respectively. The main points of the connection process are as follows:

[0024] 1. Tungsten metal surface processing: use wire cutting to process wave grooves on the tungsten surface. The shape and size of the grooves are as attached. figure 2 Shown:

[0025] 2. Surface treatment of tungsten metal and copper metal: the tungsten wave surface is polished with metallographic sandpaper, and then cleaned with alcohol and acetone respectively; the pure copper to be cladding is polished with metallographic sandpaper, and then cleaned with alcohol and acetone respectively;

[0026] 3. Cladding: Put the pure copper to be cladding on the tungsten wave surface, put it in a graphite mold, and place it in a vacuum diffusion furnace. The heating rate is 180℃ / h, the holding temperature is 1160°C, and the holding time is 30 minutes. Cool slowly. After cladding, the thickness of...

Embodiment 2

[0030] In the cladding step, the heating rate is 150°C / h, the holding temperature is 1150°C, and the holding time is 40 minutes.

[0031] In the vacuum diffusion welding step, the heating temperature is 900°C, the holding time is 45 minutes, and the connection pressure is 8MPa.

[0032] The rest of the procedures and process parameters are the same as in Example 1.

Embodiment 3

[0034] Use industrial pure tungsten to connect with CuZn alloy (brass).

[0035] In the cladding step, the heating rate is 200°C / h, the holding temperature is 1200°C, and the holding time is 10 minutes.

[0036] In the vacuum diffusion welding step, the heating temperature is 850°C, the holding time is 90 minutes, and the connection pressure is 12 MPa.

[0037] The remaining procedures and process parameters are the same as in Example 1.

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Abstract

The invention discloses a tungsten-copper connection method, which comprises the following steps of: processing the surface of tungsten metal into a wave-shaped groove which is processed by superficial treatment: processing and washing the surface of copper metal: and then smelting and covering the copper metal on the wave-shaped surface of tungsten in a vacuum under temperature of 1150 to 1200 DEG C; processing and washing the smelt and the covered surface as well as copper alloy: and stacking and assembling the copper alloy into a welding piece which is connected by pressure and diffusion welding under temperature of 850 to 900 DEG C. The method has the advantages that solder or an intermediate layer is not adopted; the operation of the technique is simple and convenient; the cost is low; the connection effect is good; and a novel means of access for connecting tungsten and copper dissimilar metal is opened up, therefore, the method is convenient for popularization and application.

Description

Technical field [0001] The invention relates to a connection method between dissimilar metals, in particular to a connection method between dissimilar metals of tungsten and copper alloy. Background technique [0002] Tungsten (W) is often selected as a high temperature resistant material due to its high melting point (3410℃) and good corrosion resistance. As a heat resistant material, tungsten has special applications in aerospace, energy and electronics fields, such as fuel injection Tube lining, vacuum electronic device anode, etc.; Cu and its alloys are often selected as heat dissipation materials due to the characteristics of high thermal conductivity (400W / mK). It can be connected with tungsten to enhance heat dissipation. For this reason, the connector of tungsten, copper and its alloys is the preferred composite structure for plasma components. Due to the difference in mechanical and physical properties between tungsten and copper, especially the difference in thermal exp...

Claims

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Application Information

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IPC IPC(8): H01R4/62H01R43/02B22D19/16
Inventor 杨建锋李军乔冠军赵婷
Owner XI AN JIAOTONG UNIV
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