Low temperature softening organic heat conducting glue

A thermally conductive adhesive, low temperature technology, used in adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of unstable performance of thermally conductive adhesives, low thermal conductivity of thermally conductive adhesives, and inability to meet thermal conductivity requirements. Low, high thermal conductivity, the effect of improving the interface contact area

Inactive Publication Date: 2009-08-12
NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

U.S. Patents US5950066 and US6197859 synthesize low-temperature softening glue with olefins and silanes under catalytic conditions, and then add a softener to form a thermally conductive glue. The process is complicated and the performance of the thermally conductive glue is unstable. Nitrile rubber is mixed with polyvinyl acetate, and then heat-conducting powder is added to make a low-temperature softening heat-conducting adhesive with a softening temperature of 38-65°C, but the thermal conductivity is only 0.5-5W / m·K
The thermal conductivity of existing low-cost, stable-performance thermal-conductive adhesives is relatively low, which cannot meet the thermal conductivity requirements of harsh environments

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0012] (1) The weight percentage of each component of the binder: 12% low molecular weight polypropylene, 57% silicone oil, 31% stearic acid, the mixture is placed in a stirring tank at 150° C. to be heated and melted and stirred evenly.

[0013] (2) Add 81% by weight of nano flake graphite to the melted binder, continue to stir at 150° C. for at least 120 minutes, and then cool to prepare a low-temperature softening organic type heat-conducting adhesive. Its thermal conductivity is 21.4W / m·K, and its melting temperature is 67°C.

[0014] After the low-temperature softening organic type thermal conductive adhesive is melted at 75°C, the coating thickness can be controlled between 0.01 and 0.05mm, and it is coated on the 50W LED aluminum backplane, and then connected to the aluminum heat sink, and the experimental test is performed. The thermal resistance is 0.014°Cm 2 / W, can be used as a thermally conductive adhesive between high-power LEDs and heat sinks.

Embodiment 2

[0016] (1) The weight percentage of each component of the binder: 12% low molecular weight polypropylene, 57% silicone oil, 31% stearic acid, the mixture is placed in a stirring tank at 150° C. to be heated and melted and stirred evenly.

[0017] (2) Add 80% by weight of nano flake graphite and 1% of nano diamond to the melted binder, continue to stir at 150°C for at least 120 minutes and then cool to make a low-temperature softening organic heat-conducting adhesive. Its thermal conductivity is 22.3W / m·K, and its melting temperature is 67°C.

[0018] Melt the low-temperature softening organic type heat-conducting adhesive at 75°C, add 20% by weight of carbon tetrachloride, and stir for more than 45 minutes. The coating thickness can be controlled between 0.01 and 0.05mm, and it is coated on the aluminum back of 50WLED On the board, after the carbon tetrachloride is completely volatilized, it is connected to the aluminum radiator, and the thermal resistance value is 0.010°Cm ac...

Embodiment 3

[0020] (1) The weight percentage of each component of the binder: 12% low molecular weight polypropylene, 57% silicone oil, 31% stearic acid, the mixture is placed in a stirring tank at 150° C. to be heated and melted and stirred evenly.

[0021] (2) Add 80% by weight of nano flake graphite and 3% of nano diamond to the melted binder, continue to stir at 150°C for at least 120 minutes and then cool to make a low-temperature softening organic heat-conducting adhesive. Its thermal conductivity is 23.7W / m·K, and its melting temperature is 67°C.

[0022] Melt the low-temperature softening organic type heat-conducting adhesive at 75°C, add 20% by weight of n-hexane, and stir for more than 45 minutes. The coating thickness can be controlled between 0.01 and 0.05mm, and it is coated on the 50W LED aluminum backplane , after the n-hexane is completely volatilized, it is connected to the aluminum heat sink, and the thermal resistance value is 0.0083°Cm according to the experimental tes...

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Abstract

The invention discloses a low-temperature softening organic type heat conducting glue. A nano heat conducting powder body and a bonding agent are mixed to prepare the heat conducting glue; and the weight percent of the nano heat conducing powder body and the bonding agent are: 80 to 85 percent of nano heat conducing powder body and 15 to 20 percent of bonding agent. The nano heat conducing powder body is one of nano scale graphite or nano diamond or the combination of both. The bonding agent consists of low molecular weight polypropylene, silicon oil and stearic acid; and the bonding agent comprises the following components by weight percentage: 10 to 20 percent of low molecular weight polypropylene, 40 to 60 percent of silicon oil and 30 to 40 percent of stearic acid. The heating conducting glue has low cost and high heat conductivity coefficient, can be softened and formed at a softening temperature of 43 to 71 DEG C, and can obviously improve the interface contact area and the heat conductivity between a heat dissipater and a high heating electronic element. The low-temperature softening organic type heat conducting glue has no decomposition, no degeneration, stable performance and no corrosion to electronic elements.

Description

technical field [0001] The invention relates to an organic heat-conducting adhesive, in particular to a low-temperature softening organic heat-conducting adhesive which improves the heat conduction efficiency of the interface between a radiator and a high-heating electronic component. Background technique [0002] At present, the heat conduction method of the interface between the heat sink and the high-heating electronic components is mainly to apply heat conduction glue. There are mainly the following types of thermally conductive adhesives: one is to add thermally conductive powder with high thermal conductivity to silicone oil or mineral oil, such as ceramic powder, graphite powder, carbon fiber, carbon nanotube or metal powder. However, due to the limitation of thermal conductive powder content and particle shape, and the volatilization of small molecular substances during use and drying, the thermal conductivity of this type of thermal conductive adhesive is generally ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/00C09J11/04C09J183/00
Inventor 华云峰李争显杜继红杜明焕王彦峰
Owner NORTHWEST INSTITUTE FOR NON-FERROUS METAL RESEARCH
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