Welding structure and method of target and backing plate

A welding method and welding structure technology, which is applied in welding equipment, non-electric welding equipment, metal material coating technology, etc., can solve the problems that the atoms on the metal contact surface cannot be effectively diffused, and the joint strength cannot meet the requirements, so as to achieve the bonding strength Effect of improving, improving efficiency, and preventing oxidation
CN101537533AInactive Publication Date: 2009-09-23KONFOONG MATERIALS INTERNATIONAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KONFOONG MATERIALS INTERNATIONAL CO LTD
Publication Date
2009-09-23
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to a welding structure and a method of a target and a backing plate, wherein the welding method of the target and the backing plate includes the steps of: providing a titanium target and an aluminum backing plate; forming a groove on the aluminum backing plate; mounting the titanium target in the groove; and adopting a hot isostatic pressing method to weld the titanium target and the aluminum backing plate. The invention greatly reduces the use amount of welding materials and simultaneously, the technology does not affect the tissue structure of the target and causes the quality of the target to meet the final use requirement.
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Description

technical field

[0001] The invention relates to the field of semiconductor manufacturing, in particular to a welding structure and method of a target material and a back plate. Background technique

[0002] In the manufacture of large-scale integrated circuits, the target component is composed of a target that meets the sputtering performance and a back plate that is combined with the target and has a certain strength. The back plate can play a supporting role when the target assembly is assembled to the sputtering base station, and has the effect of conducting heat.

[0003] At present, the process of welding the target material and the back plate usually adopts a hot isostatic pressing (HIP) diffusion welding process. The hot isostatic pressing process is a process method that uses uniform static pressure in all directions to press at high temperature. This method uses a metal or ceramic sheath (low carbon steel, Ni, Mo, glass, etc.), and uses nitrogen or argon as a pres...

Claims

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