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Double-stage switching system of photoetching machine wafer stage

A technology for exchanging systems and wafer stages, which is applied in the field of dual-stage exchanging systems for lithography machine wafer stages, can solve the problems of non-centroid drive, high processing and assembly precision, etc., and achieve lower requirements for installation accuracy and unsatisfactory dimensional consistency requirements The effect of improving and simplifying the structure of the control system

Active Publication Date: 2011-07-20
TSINGHUA UNIV +1
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Problems solved by technology

[0008] Aiming at the deficiencies and defects of the prior art, the purpose of the present invention is to provide a new double-stage exchange system for silicon wafer stages of a lithography machine, so as to overcome the non-centroid-driven and extremely demanding processing of the existing double-stage exchange system for silicon wafer stages. And assembly accuracy and other shortcomings, so that it has the advantages of simple structure, high space utilization and no collision between the upper linear guide rails during exchange, thereby improving the exposure efficiency of the lithography machine

Method used

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  • Double-stage switching system of photoetching machine wafer stage
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  • Double-stage switching system of photoetching machine wafer stage

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Embodiment Construction

[0023] figure 2It shows the structural schematic diagram of the double wafer stage exchange system of the lithography machine. The system includes a rectangular base 1 (the long side is in the X direction, and the short side is in the Y direction), and the first wafer stage running in the exposure station 3 13. The second wafer stage 14 running in the pretreatment station 4. The two wafer stages are set on the base stage, and are suspended on the upper surface 2 of the base stage through the air bearing 22 on the bottom surface of the wafer stage. The first Y-direction linear motor stator 5 and the second Y-direction linear motor stator 6 are respectively arranged on the two long sides of the base, the first main driving unit 11, the first single-degree-of-freedom auxiliary driving unit 7 and the second single-freedom The auxiliary drive unit 8 shares the first Y direction linear motor stator 5, and the second main drive unit 12, the third single degree of freedom auxiliary d...

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Abstract

The invention provides a double-stage switching system of photoetching machine wafer stage, wherein the system comprises a wafer stage operating on exposure station and a wafer stage operating on preprocess station, the two wafer stage is fixed on a base station and suspend on upper surface by air-float bearings; each wafer stage is passed through by a guiding rail along Y direction respectively,one end of the guiding rail is connected with a main driving unit, the two wafer stages can move in Y direction along the guiding rails, the other end of the wafer stage is abutted against a single freedom degree auxiliary driving unit in X direction, and can move in X direction under drive of the single degree of freedom auxiliary driving unit; and the single degree of freedom auxiliary driving unit and the guiding rail in Y direction can implements separation and precision butt joint for implementing position switch of the two wafer stages. The system of the invention avoids accuracy requirement of sky high wafer stage dimensional uniformity caused by switch of the air-float bearing cross guide plane when the wafer stages switches, and avoids defect of high precision require of componentprocess and assembly, thereby simplifying system structure, and double-stage switch of the system is driven by mass center, thereby greatly enhancing precision of the system.

Description

technical field [0001] The invention relates to a double-swap exchange system for silicon wafer tables of a lithography machine. The system is applied to a semiconductor lithography machine and belongs to the technical field of semiconductor manufacturing equipment. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer (photolithography) of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine). The resolution and exposure efficiency of the lithography machine greatly affect the characteristic line width (resolution) and productivity of the integrated circuit chip. As the key system of the lithography machine, the motion accuracy and work efficiency of the silicon wafer ultra-precision motion positioning system (hereinafter referred to as the wafer stage) largely...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70733G03F7/70716
Inventor 朱煜张鸣汪劲松田丽徐登峰尹文生段广洪胡金春
Owner TSINGHUA UNIV
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