Method for preparing ethylene rhodanate-epoxy-POSS hybrid resin

Abstract

The invention relates to a method for preparing ethylene rhodanate-epoxy-POSS hybrid resin, which is mainly applied to advanced electronic packaging substrate materials. Heat resistance and dielectric property are hard to be enhanced significantly only by molecular design of epoxide resin at present. Ethylene rhodanate modified epoxy has better heat resistance but unobvious improvement of dielectric property; and dent resistance is greatly affected and moisture absorption is relatively high. The invention adopts unique functionalized hollow polyhedral oligmeric silsesquioxane nanometer oligomer modified epoxy-ethylene rhodanate, thus obtaining the advanced electronic packaging substrate resin with good heat resistance and low dielectric property; the solidified hybrid material has good net-working structure; and the polyhedral oligmeric silsesquioxane is dispersed in the resin substrate at molecular level. The mechanical property of the resin substrate is significantly improved; moreover, the heat resistance, the dielectric property and the moisture absorption property are good. The hybrid resin can be used for a long time at the high temperature of 200 DEG C.

Description

technical field

[0001] The invention relates to a preparation method of a cyanate ester-epoxy resin nanometer hybrid material, which belongs to the field of organic polymer materials. Background technique

[0002] With the development of social informatization, high-speed information processing and information dissemination, and miniaturization of equipment, it is urgent to provide a printed circuit composite material with high heat resistance and ultra-low dielectric properties. Epoxy resin has become a widely used printed circuit composite material due to its good processing performance, low price, sufficient supply, and excellent comprehensive performance. However, in recent years, in order to meet the demand for advanced composite materials in the field of ultra-thin micro-nano printed circuit substrates, the heat resistance and dielectric properties of epoxy resins have been further improved, especially the dielectric constant and dielectric loss in a wide frequency ran...

Examples

Embodiment 1

[0016] Embodiment 1: Dissolve 400g of bisphenol A type cyanate resin and 600g of brominated bisphenol A type epoxy resin in acetone, make 85wt% mixed solution, add 20g of tetrafunctional epoxy group cage type sesquite For siloxane, add catalyst manganese octoate 0.1g, catalyst 2-methylimidazole 0.2g, stir evenly, pre-react with vacuum at 60°C for 2 hours, then pour into a mold at 80°C, vacuumize and heat to 160°C for 1 hour to cure , After curing for 2 hours at 200°C, the desired cyanate-epoxy resin hybrid material was obtained. Its performance is shown in Table 1.

Embodiment 2

[0017] Embodiment two: 100g bisphenol A type cyanate ester resin and 900g brominated bisphenol A type epoxy resin are dissolved in acetone, are made into 85wt% mixed solution, add 10g tetrafunctional epoxy group cage type sesquite For siloxane, add 0.1g of manganese octoate catalyst and 0.2g of 2-methylimidazole catalyst, stir evenly, pre-react with vacuum at 60°C for 2 hours, then pour into a mold at 80°C, vacuumize and heat to 180°C for 2 hours to cure , After curing for 2 hours at 200°C, the desired cyanate-epoxy resin hybrid material was obtained. Its performance is shown in Table 1.

Embodiment 3

[0018] Embodiment three: 350g bisphenol A type cyanate ester resin, 50g novolak type cyanate ester and 800g brominated bisphenol A type epoxy resin, 100g four-functionalization epoxy resin are dissolved in acetone, are made into 85wt% Mix the solution, add 10g tetrafunctional epoxy group cage silsesquioxane, add catalyst manganese octoate 0.1g, catalyst 2methylimidazole 0.2g, stir evenly, vacuum pre-react at 60°C for 2 hours, then pour into 80 ℃ in the mold, vacuumize and heat to 180 ℃ for 2 hours to cure, 200 ℃ after curing for 2 hours to obtain the desired cyanate ester-epoxy resin hybrid material. Its performance is shown in Table 1.

technical field

[0001] The invention relates to a preparation method of a cyanate ester-epoxy resin nanometer hybrid material, which belongs to the field of organic polymer materials. Background technique

[0002] With the development of social informatization, high-speed information processing and information dissemination, and miniaturization of equipment, it is urgent to provide a printed circuit composite material with high heat resistance and ultra-low dielectric properties. Epoxy resin has become a widely used printed circuit composite material due to its good processing performance, low price, sufficient supply, and excellent comprehensive performance. However, in recent years, in order to meet the demand for advanced composite materials in the field of ultra-thin micro-nano printed circuit substrates, the heat resistance and dielectric properties of epoxy resins have been further improved, especially the dielectric constant and dielectric loss in a wide frequency ran...

Examples

Embodiment 1

[0016] Embodiment 1: Dissolve 400g of bisphenol A type cyanate resin and 600g of brominated bisphenol A type epoxy resin in acetone, make 85wt% mixed solution, add 20g of tetrafunctional epoxy group cage type sesquite For siloxane, add catalyst manganese octoate 0.1g, catalyst 2-methylimidazole 0.2g, stir evenly, pre-react with vacuum at 60°C for 2 hours, then pour into a mold at 80°C, vacuumize and heat to 160°C for 1 hour to cure , After curing for 2 hours at 200°C, the desired cyanate-epoxy resin hybrid material was obtained. Its performance is shown in Table 1.

Embodiment 2

[0017] Embodiment two: 100g bisphenol A type cyanate ester resin and 900g brominated bisphenol A type epoxy resin are dissolved in acetone, are made into 85wt% mixed solution, add 10g tetrafunctional epoxy group cage type sesquite For siloxane, add 0.1g of manganese octoate catalyst and 0.2g of 2-methylimidazole catalyst, stir evenly, pre-react with vacuum at 60°C for 2 hours, then pour into a mold at 80°C, vacuumize and heat to 180°C for 2 hours to cure , After curing for 2 hours at 200°C, the desired cyanate-epoxy resin hybrid material was obtained. Its performance is shown in Table 1.

Embodiment 3

[0018] Embodiment three: 350g bisphenol A type cyanate ester resin, 50g novolak type cyanate ester and 800g brominated bisphenol A type epoxy resin, 100g four-functionalization epoxy resin are dissolved in acetone, are made into 85wt% Mix the solution, add 10g tetrafunctional epoxy group cage silsesquioxane, add catalyst manganese octoate 0.1g, catalyst 2methylimidazole 0.2g, stir evenly, vacuum pre-react at 60°C for 2 hours, then pour into 80 ℃ in the mold, vacuumize and heat to 180 ℃ for 2 hours to cure, 200 ℃ after curing for 2 hours to obtain the desired cyanate ester-epoxy resin hybrid material. Its performance is shown in Table 1.

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