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Packaging housing of humidity-sensitive electronic device, substrate and leakproof structure thereof

A technology for encapsulating shells and electronic devices, applied in the direction of electric solid devices, piezoelectric/electrostrictive/magnetostrictive devices, electrical components, etc., can solve the problem of reducing the bonding performance of the substrate and the encapsulating shell, and achieve good adhesion Performance and encapsulation effect, effect of encapsulation effect improvement

Active Publication Date: 2009-11-04
GUAN YEOLIGHT TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the water-oxygen barrier capability of the substrate and the packaging shell is generally much higher than that of the sealing material, and water and oxygen are more likely to enter the device from the sealing material between the substrate and the packaging shell, so reducing the thickness of the sealing material in contact with the environment can effectively reduce the The intrusion of water and oxygen, however, reducing the thickness of the sealing material will often reduce the bonding performance of the substrate and the package shell. In order to improve the bonding performance of the substrate and the package shell, many devices even add isolation balls to the sealing material to increase the bonding performance of the sealing material. thickness

Method used

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  • Packaging housing of humidity-sensitive electronic device, substrate and leakproof structure thereof
  • Packaging housing of humidity-sensitive electronic device, substrate and leakproof structure thereof
  • Packaging housing of humidity-sensitive electronic device, substrate and leakproof structure thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0020] Glass substrate / ITO / NPB(50nm) / Alq(50nm) / Mg:Ag / glass sheet with a ring of grooves

[0021] (1) Cleaning of glass substrates pre-engraved with ITO: use hot detergent ultrasonic and deionized water ultrasonic methods to clean the transparent conductive substrate ITO glass, place it under an infrared lamp to dry after cleaning, and then The dried ITO glass is pretreated by ultraviolet ozone cleaning and low-energy oxygen ion beam bombardment. The ITO film on the conductive substrate is used as the anode layer of the device. The square resistance of the ITO film is 50Ω and the film thickness is 150nm;

[0022] (2) Preparation of the organic light-emitting layer: the above-mentioned cleaned and dried ITO glass that has been pretreated is placed in a vacuum chamber, and the vacuum is evacuated to 1×10 -3 Pa, and then evaporate a layer of hole transport material NPB on the above-mentioned ITO film, the evaporation rate of the material film is 0.5nm / s, and the film thickness is ...

Embodiment 2

[0026] Glass substrate / ITO / NPB / Alq / Mg:Ag / PI / glass sheet with two grooves

[0027] The preparation steps are the same as in Example 1, except that two circles of grooves 302 with a depth of 1 mm and a width of 0.75 mm are made on the packaging glass 303, glue is dispensed on the two circles of grooves, and then the packaging glass 303 is pressed together and the substrate 301, the thickness of the sealing material exposed to gas was 4 μm.

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Abstract

The invention relates to a packaging housing of a humidity-sensitive electronic device, a substrate and a leakproof structure thereof. In the premise that the thickness of leakproof material is not reduced, the thickness of the leakproof material contacted with the environment is reduced. The packaging housing of the humidity-sensitive electronic device and / or the edge of the substrate contains a round of or more rounds of grooves used for being poured into the leakproof material. The humidity-sensitive electronic device can be an organic electroluminescence device, a micro-machine electrical sensor and a charge coupled device sensor. by manufacturing the grooves on the substrate of the device and / or the packaging housing, the invention pours the leakproof material into the grooves, thus reducing the thickness of the leakproof material contacted with the environment in the premise that the thickness of leakproof material is not reduced, achieving the technical effects of not reducing the adhesive property of the substrate and the packaging housing and increasing the packaging effect; when a plurality of grooves exist, better adhesive property and packaging effect exist.

Description

technical field [0001] The invention relates to a package casing, a base and a sealing structure of a moisture-sensitive electronic device. Background technique [0002] Humidity-sensitive electronic devices are very sensitive to water and oxygen in the environment, and usually need to be packaged, such as organic electroluminescent devices (OLED), charge-coupled device sensors (CCD), and micro-electromechanical sensors (MEMS). An effective method of encapsulation is to use a sealing material to bond the substrate of the device and the package shell together. [0003] In order to further enhance the encapsulation effect, a desiccant is usually added between the encapsulation shell and the substrate. [0004] However, with the improvement of device performance requirements, the existing packaging effect still cannot meet the requirements of the device, because as the area of ​​the device exposed to environmental water and oxygen increases, the amount of water and oxygen infi...

Claims

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Application Information

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IPC IPC(8): H01L23/02H01L23/13H01L51/52H01L29/765B81B7/02
Inventor 邱勇张德强高裕弟徐粤周少华
Owner GUAN YEOLIGHT TECH CO LTD
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