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Phosphorus-containing flame retardant and curable flame -retarded resin compositions containing the same

A phosphorus flame retardant and flame retardant technology, which is applied in the field of phosphorus flame retardants and curable flame retardant resin compositions containing the flame retardant, can solve the problem of low adaptability of solder resist materials, hard cured products and Brittleness, lack of sensitivity and softness of the cured product, etc., to achieve the effect of excellent curability and flexibility

Inactive Publication Date: 2009-11-04
SHOWA DENKO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when these reactive phosphorus compounds or phosphorus-containing epoxy resins are used alone in an amount sufficient to exhibit flame retardancy, the cured product becomes hard and brittle, and cannot be used, for example, in solder resist materials used in flexible substrates. application
In addition, Patent Document 6 proposes a phosphorus-containing acrylate compound obtained by reacting a (meth)acrylate compound with a reactive phosphorus compound, but the balance between the sensitivity and the flexibility of the cured product is lacking. Low adaptability of solder resist materials

Method used

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  • Phosphorus-containing flame retardant and curable flame -retarded resin compositions containing the same
  • Phosphorus-containing flame retardant and curable flame -retarded resin compositions containing the same
  • Phosphorus-containing flame retardant and curable flame -retarded resin compositions containing the same

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Embodiment

[0106] The present invention will be described more specifically by way of examples, but the present invention is not limited by these examples. In addition, "part" in an Example and a comparative example means a "mass part" unless otherwise specified.

Embodiment 1

[0109] Add KAYARADDPCA30 (trade name, R in formula (1) in the reaction vessel that has stirring device, thermometer, condenser 1 is a hydrogen atom, n+m+l+o+p+q=3, manufactured by Nippon Kayaku Co., Ltd.) 921 g (1 mole), HCA (trade name, 9,10-dihydro-9-oxa-10- Phosphophenanthrene-10-oxide, manufactured by Sanko Co., Ltd.) 388.8g (1.8 moles), propylene glycol methyl ether acetate 327g, p-methoxyphenol (Metokinon) 1.3g, reacted at 110° C. for 13 hours while blowing air, Compound 1 having a non-volatile portion concentration of 80% by mass and a phosphorus content in the non-volatile portion of 4.3% by mass was obtained.

Embodiment 2

[0111] 921 g (1 mole) of KAYARADDPCA30 (trade name, manufactured by Nippon Kayaku Co., Ltd.), 648 g (3.0 moles) of HCA (trade name, manufactured by Sanko Co., Ltd.), propylene glycol methyl 392 g of ether acetate and 1.5 g of p-methoxyphenol were reacted at 110° C. for 13 hours while blowing air to obtain Compound 2 with a nonvolatile concentration of 80% by mass and a phosphorus content in the nonvolatile portion of 5.9% by mass.

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Abstract

The invention aims at providing a phosphorus-containing flame retardant free from halogen compounds; and curable flame-retarded resin compositions containing the flame retardant, which are curable through radical polymerization and excellent in curability and which can give cured articles excellent in flame retardance, curing properties, and flexibility. The invention relates to a phosphorus-containing flame retardant obtained by reacting (meth)acryloyl of a polyfunctional (meth)acrylate having a specific structure with a phosphorus compound having a P-H bond; and curable flame-retarded resin compositions each comprising the flame retardant, an alkali-soluble resin, a (meth)acrylate compound, an epoxy resin, a photopolymerization initiator and, if necessary, a filler.

Description

[0001] Technology area [0002] The invention relates to a phosphorus-containing flame retardant without halides and the phosphorus-containing flame retardant, which can be cured by free radical polymerization, suitable for electronic substrates, electronic components, and especially suitable for flexible solder resist (solder resist) materials etc. curable flame retardant resin composition. Background technique [0003] Resins used in electrical equipment, electronic components, etc., are expected to have flame retardancy from the viewpoint of safety such as fire prevention. Previously, bromide-based organic halogen-containing compounds were used as flame retardants, which can be used in combination with curing properties. Curable flame retardant resin composition in resin. The curable flame retardant resin composition containing an organic halogen compound has excellent flame retardancy, but the curable flame retardant resin composition may produce harmful compounds such as...

Claims

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Application Information

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IPC IPC(8): C09K21/12C08G63/692C08K5/101C08L63/00C08L67/00C08L101/00
CPCC08G18/755C08G18/4854C08G18/672C08L75/08C09K21/12C08K3/32H05K3/287C08G18/348C08L63/00C08L33/06C08G18/12C09D5/18
Inventor 李晖高桥健太郎镰田博稔
Owner SHOWA DENKO KK