Plasma etching method and plasma etching apparatus

Abstract

Provided is a plasma etching method capable of controlling an etching shape readily and properly during a plasma etching process. The plasma etching method includes: holding a semiconductor substrate W on a holding table 14 installed in a processing chamber 12; generating a microwave for plasma ignition; generating plasma in the processing chamber 12 by setting a gap between the dielectric plate 16 and the holding table 14 to be equal to or greater than about 100 mm and setting a pressure inside the processing chamber 12 to be equal to or higher than about 50 mTorr, and introducing the microwave into the processing chamber 12 via the dielectric plate 16; and performing a plasma etching process on the semiconductor substrate W by the plasma generated by supplying a reactant gas for plasma etching process into the processing chamber 12.

Description

technical field [0001] The present invention relates to a plasma etching treatment method and a plasma etching treatment apparatus, and particularly to a plasma etching treatment method and a plasma etching treatment apparatus used in a semiconductor device manufacturing process. Background technique [0002] Semiconductor devices such as LSI (Large Scale Integrated Circuit) are manufactured by performing various processes such as etching, CVD (Chemical Vapor Deposition), and sputtering on a semiconductor substrate. Regarding processes such as etching, CVD, and sputtering, there are processing methods using plasma as an energy supply source, that is, plasma etching, plasma CVD, and plasma sputtering. [0003] With recent miniaturization and multilayer wiring of LSIs, the above-mentioned plasma treatment is effectively utilized in each process of manufacturing a semiconductor device. For example, in plasma processing in the manufacturing process of semiconductor devices such...

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Problems solved by technology

It is necessary to adopt the above-mentioned ultra-low pressure process conditions, even if it is considered from the perspective of the best use of the equipment, it is not good

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