Computer cleaning rubber and preparation method thereof

Abstract

The invention provides a computer cleaning rubber which comprises the following ingredients by weight percent: 2.5-5.0 percent of dioctyl phthalate, 10-20 percent of calcium carbonate, 0.1-0.4 percent of stearic acid, 5-15 percent of french chalk, 6-10 percent of butyl rubber, 0.2-0.9 percent of ethyl butene, 0.6-2.0 percent of white carbon black, 3-8 percent of softening oil, and 3-6 percent of surfactant. The invention also provides a preparation method of the cleaning rubber, which comprises the following steps of: (1) plasticating: conducting plastication on butyl rubber to obtain plasticated rubber; (2) roll-milling: weighting the plasticated rubber, dioctyl phthalate, stearic acid and isobutene according to weight ratio so as to conduct roll-milling for obtaining roll-milled rubber; (3) mixing: weighting all the ingredients according to weight ratio to conduct mixing for obtaining mixed rubber; and (4) standing the mixed rubber obtained in step (3) and then obtaining finished products after compound outputting. The cleaning rubber has wide material sources, simple preparation technology and easily controlled conditions; and the products is applicable to the cleaning of computers and peripheral devices, has good decontamination effect and is environmental friendly.

Description

technical field [0001] The invention relates to the field of chemistry and chemical engineering, and relates to cleaning glue, in particular to a computer cleaning glue used for cleaning the surface or gaps of computers and their peripheral equipment and a preparation method thereof. Background technique [0002] In the prior art, when cleaning the surface of computers and computer peripherals, most of them are wiped with water-containing rags, or blown by high-pressure air guns. These methods can usually effectively remove the dust of the computer and peripheral equipment, but the dust and fines in the gaps cannot be handled well, especially the circuit boards in the computer case cannot be handled well, which leads to There will be a lot of dust and fines left in the chassis and gaps, and water stains will be left when wiping with a rag, which will affect the service life and quality of use of the computer. [0003] At the same time, the traditional cleaning method is als...

AI Technical Summary

Problems solved by technology

These methods can usually effectively remove the dust of the computer and peripheral equipment, but the dust and fines in the gaps cannot be handled well, especially the circuit boards in the computer case cannot be handled well, which leads to There will be a lot of dust and fines remaining in the chassis and gaps, and water stains will be left when wiping with a rag, which will affect the service life and quality of the computer

[0003] At the same time, the traditional cleaning method is also harmful to the human body, and also has a certain damage to the computer system. Cleaning products that have no harm to computers have become the needs of the time

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