Silicon slice platform multi-platform exchange system adopting magnetic levitation planar motor

Abstract

The invention relates to a silicon slice platform multi-platform exchange system adopting a magnetic levitation planar motor, which is mainly used in a lithography machine system. The silicon slice platform multi-platform exchange system comprises a base platform, a silicon slice platform group and a silicon slice platform driving device, wherein, the silicon slice platform group comprises a plurality of silicon slice platforms which have the same structure and are respectively worked in pretreatment working positions or exposure working positions, the silicon slice platform driving device adopts the magnetic levitation planar motor, a stator of the magnetic levitation planar motor is arranged at the top of the base platform, and rotors of the planar motor are arranged at the bottom of the silicon slice platform. The invention discloses a specific example of one silicon slice platform multi-platform exchange system adopting the moving coil type permanent magnet magnetic levitation planar motor. In the example, the stator of the planar motor adopts a novel planar permanent magnet array, wherein, the magnetizing directions of adjacent permanent magnets mutually form an angle of 45 degrees. The silicon slice platform multi-platform exchange system realizes multi-platform exchange and progressive scanning motion on a plane and improves the productivity, the overlay accuracy and the resolution of the lithography machine by using the planar motor to directly drive the silicon slice platforms.

Description

technical field [0001] The invention relates to a system for exchanging multiple silicon wafer tables of a lithography machine. The system is mainly used in semiconductor lithography machines and belongs to the field of semiconductor manufacturing equipment. Background technique [0002] In the production process of integrated circuit chips, the exposure transfer (photolithography) of the design pattern of the chip on the photoresist on the surface of the silicon wafer is one of the most important processes. The equipment used in this process is called a photolithography machine (exposure machine). The resolution and exposure efficiency of the lithography machine greatly affect the characteristic line width (resolution) and productivity of the integrated circuit chip. As the key system of the lithography machine, the motion accuracy and work efficiency of the silicon wafer ultra-precision motion positioning system (hereinafter referred to as the wafer stage) largely determi...

AI Technical Summary

Problems solved by technology

However, there are also some problems in the multi-unit exchange system of the silicon wafer stage. First, the system requires extremely high precision of the guide rail docking; Large, which is undoubtedly very important for semiconductor chip factories with high space utilization requirements

The third is that the system needs to use a bridge device with a drive device when exchanging silicon wafers, which increases the complexity of the system

When this stacked drive structure realizes planar motion, both the upper layer linear motor and the silicon wafer stage directly driven by it need to be driven by the bottom layer linear motor, which greatly increases the burden on the bottom layer linear motor, and at the same time brings non-centroid drive, requiring high Problems such as precision synchronous control, the system structure is also very complicated, which limits the movement positioning accuracy of the silicon wafer stage and hinders the improvement of its positioning response speed

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