Method for forming self-assembly inhibitory film on surface of copper electrode

A copper electrode and self-assembly technology, applied in the direction of electrodes, electrolytic organic material coating, etc., can solve the problems of limited application range and low solubility, and achieve the effect of good anti-corrosion effect, simple process and convenient operation

Inactive Publication Date: 2009-12-30
SHANGHAI UNIVERSITY OF ELECTRIC POWER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since APDTC forms a weak acid in acidic medium, its solubility is very small, which limits its application range.

Method used

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  • Method for forming self-assembly inhibitory film on surface of copper electrode
  • Method for forming self-assembly inhibitory film on surface of copper electrode
  • Method for forming self-assembly inhibitory film on surface of copper electrode

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Self-assembly of anti-hydrochloric acid corrosion film on copper electrode surface

[0026] (1), the production and pretreatment of copper electrodes

[0027] Sealed with epoxy resin, the working area is 0.78cm 2 The copper electrode, the surface is 1 # ~6 # Metallographic sandpaper was polished step by step, degreased with absolute ethanol, rinsed with deionized water, and then put into the electrolytic cell. The electrolyte was 0.1mol / L KCl solution; Polarization treatment at -1.1V for 60S, repeated treatment three times for standby;

[0028] (2), configuration of self-assembly solution

[0029] Analytical pure ammonium pyrrolidinedithiocarbamate (APDTC) is formulated with a concentration of 0.01mol / L ammonium pyrrolidinedithiocarbamate (APDTC) aqueous solution;

[0030] (3) Formation of self-assembled corrosion inhibition film on copper electrode surface

[0031] Immerse the copper electrode treated in step (1) in the ammonium pyrrolidinedithiocarbamate (APDTC)...

Embodiment 2

[0033] Self-assembly of anti-hydrochloric acid corrosion film on copper electrode surface

[0034] (1), the production and pretreatment of copper electrodes

[0035] Sealed with epoxy resin, the working area is 0.78cm 2 The copper electrode, the surface is 1 # ~6 # Metallographic sandpaper was polished step by step, degreased with absolute ethanol, rinsed with deionized water, and then put into the electrolytic cell. The electrolyte was 0.1mol / L KCl solution; Polarization treatment at -1.1V for 60S, repeated treatment three times for standby;

[0036] (2), configuration of self-assembly solution

[0037] Analytical pure ammonium pyrrolidinedithiocarbamate (APDTC) is formulated with a concentration of 0.01mol / L ammonium pyrrolidinedithiocarbamate (APDTC) aqueous solution;

[0038] (3) Formation of self-assembled corrosion inhibition film on copper electrode surface

[0039] Immerse the copper electrode treated in step (1) in the ammonium pyrrolidinedithiocarbamate (APDTC)...

Embodiment 3

[0041] Self-assembly of anti-hydrochloric acid corrosion film on copper electrode surface

[0042] (1), the production and pretreatment of copper electrodes

[0043] Sealed with epoxy resin, the working area is 0.78cm 2 The copper electrode, the surface is 1 # ~6 # Metallographic sandpaper was polished step by step, degreased with absolute ethanol, rinsed with deionized water, and then put into the electrolytic cell. The electrolyte was 0.1mol / L KCl solution; Polarization treatment at -1.1V for 60S, repeated treatment three times for standby;

[0044] (2), configuration of self-assembly solution

[0045] Analytical pure ammonium pyrrolidinedithiocarbamate (APDTC) is formulated with a concentration of 0.01mol / L ammonium pyrrolidinedithiocarbamate (APDTC) aqueous solution;

[0046] (3) Formation of self-assembled corrosion inhibition film on copper electrode surface

[0047] Immerse the redox pretreated copper electrode into the 0.01mol / L ammonium pyrrolidinedithiocarbamat...

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Abstract

The invention relates to a method for forming self-assembly inhibitory film on surface of a copper electrode, belonging to the corrosion prevention technology of nonferrous metals; the method comprises the following steps: adopting analytical purity ammonium pyrrolidine dithiocarbamate (APDTC) to prepare 0.001-0.01mol/L of APDTC water solution, and immersing a pretreated copper electrode in the solution at 20-30 DEG C for 0.5-8h to absorb a layer of APDTC self-assembly inhibitory film on the surface of the copper electrode. Alternating current impedance test results show that the inhibition efficiency of the copper electrode which is treated through self-assembly in 0.01mol/L of APDTC water solution for 4-8h, in 0.5mol/L of HCl solution can reach above 95%.

Description

technical field [0001] The invention relates to a method for forming a self-assembled film on a copper surface, in particular to a self-assembled method for an APDTC film on the surface of a copper electrode corrosion-resistant to hydrochloric acid. Background technique [0002] Self-assembled monomolecular films (SAMs) are ordered molecular films formed spontaneously on the surface of solid substrates by means of chemical bonds. The corrosion inhibitor molecules are self-assembled on the metal surface to form a dense and ordered monomolecular film that can block environmental media. Erosion of the base, protecting the base metal from corrosion. [0003] Ammonium pyrrolidine dithiocarbamate (APDTC) is light yellow powder, low toxicity, soluble in water (18.9g / 100mL water at 20°C), because APDTC molecules contain N and S atoms with strong coordination ability, it is commonly used Chelating agent for atomic absorption spectrophotometric analysis, but also an effective environ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D9/02C25D17/10
Inventor 廖强强岳忠文沈曦俞镇寅
Owner SHANGHAI UNIVERSITY OF ELECTRIC POWER
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