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Method and reactor for preparing films and devices under high nitrogen chemical potential

A technology of chemical potential and nitride film, applied in chemical instruments and methods, gaseous chemical plating, from chemically reactive gases, etc., can solve problems such as poor performance

Inactive Publication Date: 2010-01-13
PALO ALTO RES CENT INC
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  • Description
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  • Application Information

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Problems solved by technology

This explanation is consistent with the relatively poor performance of green (high indium content) emitters
However, we also note that this is contrary to many conventional explanations, including the formation of high-voltage electric fields, alloy inhomogeneities, and possible strain-related structural defects
[0014] Although the mechanism by which the improved optoelectronic quality is obtained is not fully understood, these examples suggest that film growth may be beneficial in the presence of high nitrogen partial pressures

Method used

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  • Method and reactor for preparing films and devices under high nitrogen chemical potential
  • Method and reactor for preparing films and devices under high nitrogen chemical potential
  • Method and reactor for preparing films and devices under high nitrogen chemical potential

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Embodiment Construction

[0040] Below we describe several approaches to fabricate epitaxial nitride semiconductor thin films, heterostructures, and devices at high nitrogen chemical potentials. These methods involve operating at high total pressure and high nitrogen precursors (e.g. high partial pressure NH 3 ) combined with growth; pre-dissociation of the precursor gas, for example by pre-cracking with a catalytic metal surface; pre-pyrolysis; use of catalytically-cracked molecular nitrogen as nitrogen precursor; or exposing the surface to a rich in an environment containing reactive nitrogen. Overall, the following description follows Figure 11 The method shown in , however, the overall process of forming nitride semiconductor devices is not further discussed in this paper. However, unless otherwise indicated, it should be recognized that the steps and methods described herein are consistent with Figure 11 An overall overview of the method is provided. In addition, NH 3 (Ammonia) refers gener...

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Abstract

Nitride semiconductor films, such as for use in solid state light emitting devices and electronic devices, are fabricated in an environment of relatively high nitrogen potential such that nitrogen vacancies in the growing film are reduced. A reactor design, and method for its use, provide high nitrogen precursor partial pressure, precracking of the precursor using a catalytic metal surface, prepyrolyzing the precursor, using catalytically-cracked molecular nitrogen as a nitrogen precursor, and / or exposing the surface to an ambient which is extremely rich in active nitrogen species. Improved efficiency for light emitting devices, particularly in the blue and green wavelengths and improve transport properties in nitride electronic devices, i.e., improved performance from nitride-based devices such as InGaAlN laser diodes, transistors, and light emitting diodes is thereby provided.

Description

technical field [0001] The present invention relates to semiconductor devices and methods of making the same; and more particularly, to epitaxial nitride semiconductor thin films, heterostructures and devices, and methods of making them under conditions of high nitrogen chemical potential. Background technique [0002] Nitride semiconductor light-emitting diodes (LEDs), laser diodes (LDs), and electronic devices are typically formed by metal-organic chemical vapor deposition (MOCVD) epitaxial growth. For aluminum-gallium-indium-nitride (AlGaInN) quantum well (QW) LEDs and LDs, the AlGaInN quantum well active region and pn structure form a key part of the device. An ideal crystalline film for such nitride devices should be free of neither extended defects (such as dislocations or phase boundaries resulting from lattice mismatch) nor point defects (such as impurities, vacancies, interstitials, etc.). It is these deficiencies that prevent light-emitting devices from achieving ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/205C23C16/00
CPCC30B25/02C30B29/403C30B25/14
Inventor D·P·布尔P·季泽尔C·L·查N·M·约翰逊杨志鸿J·E·诺斯拉普
Owner PALO ALTO RES CENT INC
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