Nano-enhanced leadless solder and preparation method thereof

A lead-free solder, nano-enhanced technology, used in welding equipment, welding/cutting media/materials, welding media, etc., can solve problems such as low yield strength, poor wettability of welded joints, and low tensile strength

Active Publication Date: 2010-02-24
YIK SHING TAT INDUSTRIALCO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to solve the problems of poor wettability, low tensile strength and low yield s

Method used

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  • Nano-enhanced leadless solder and preparation method thereof
  • Nano-enhanced leadless solder and preparation method thereof
  • Nano-enhanced leadless solder and preparation method thereof

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specific Embodiment approach 1

[0010] Embodiment 1: In this embodiment, the nano-reinforced lead-free solder is made of carbon nanotubes and Sn-58Bi solder; wherein the mass content of carbon nanotubes in the mixture of carbon nanotubes and Sn-58Bi solder is 0.03% to 0.07%.

specific Embodiment approach 2

[0011] Specific embodiment two: the preparation method of the nano-reinforced lead-free solder in the specific embodiment one is as follows: 1. Add carbon nanotubes in the mixed acid solution, sonicate for 1.5h under the condition of ultrasonic power of 100W, and then Stir for 2 hours under conditions, then naturally cool to room temperature, and then centrifuge at a speed of 800 rpm for 30 minutes; 2. Wash the carbon nanotubes treated in step 1 with deionized water until the pH of the washing solution is 7, filter, and pour into the filter residue Add absolute ethanol to the mixture, wherein the volume ratio of filter residue to absolute ethanol is 1:10, then dry in a quartz tube filled with argon at a temperature of 60°C for 2.5 hours, and then dry in a drying room with an air pressure of less than 30Pa and a temperature of Dry at 80°C for 2.5 hours, and then ball mill for 7 hours at a speed of 260r / min; 3. Mix the carbon nanotubes treated in step 2 with Sn-58Bi solder, and t...

specific Embodiment approach 3

[0015] Embodiment 3: This embodiment differs from Embodiment 2 in that the mass ratio of the grinding balls to the filter residue in step 2 is 40:1. Others are the same as in the second embodiment.

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Abstract

The invention relates to a nano-enhanced leadless solder and a preparation method thereof, solving the problems of poor wettability, low tensile strength and low yield strength of 0.2% of the joint soldered by the existing Sn-58Bi solder. The method comprises the following steps: washing precipitate obtained by ultrasonically and centrifugally treating a carbon nano-tube in the mixed acid solutionby de-ionized water until the pH of the lotion is 7, filtering, adding anhydrous ethanol into filter residue, drying; adding the Sn-58Bi solder according to the predetermined weight percentage, ballmilling and pressing to obtain a blank, sintering the blank to obtain the leadless solder. The leadless solder for soldering obtained by the method has wetting angle of 24.6-26.2 DEG, 0.2% yield strength of 39.1-47.1MPa of the soldered joint, tensile strength of 51.5-57.5MPa and extensibility of 55.90-57.24% of the joint.

Description

technical field [0001] The invention relates to a solder and a preparation method thereof. Background technique [0002] Sn-58Bi alloy is a rational material for low-temperature lead-free solder, but since the Sn-Bi solder increases with the mass fraction of Bi, the solid solution or precipitation of Bi in Sn reduces the strength of the alloy, thereby reducing the plasticity and toughness, and the ductility The rate is significantly reduced, resulting in poor wettability, high melting point, low tensile strength and low 0.2% yield strength. Using the existing Sn-58Bi solder for brazing welding, the wetting angle of the welded joint is 28.1°, the 0.2% yield strength is 37.5MPa, and the tensile strength is 37.5MPa. Contents of the invention [0003] The technical problem to be solved by the present invention is to solve the problems of poor wettability, low tensile strength and low yield strength of 0.2% of the welded joint by applying the existing Sn-58Bi solder, and provi...

Claims

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Application Information

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IPC IPC(8): B23K35/26B22F3/16B02C17/00B02C17/20
Inventor 何鹏马鑫安晶徐金华吕晓春
Owner YIK SHING TAT INDUSTRIALCO LTD
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