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Rosin-free, lead-free and cleaning-free soldering paste containing activity control agent

A technology of control agent and surfactant, applied in the field of rosin-free lead-free no-clean solder paste, to achieve the effect of solving the requirements of more residues after welding, high activity and prolonging shelf life

Active Publication Date: 2010-03-17
XIAMEN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a rosin-free lead-free no-clean solder paste containing an activity control agent for the defects of the existing rosin-type solder paste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The solder alloy powder Sn3.0Ag0.5Cu was mixed with the solder paste A with the following composition (calculated by mass percentage) to make a solder paste, and its wettability and viscosity were tested.

[0027] The composition of solder paste A is as follows:

[0028] 3-(5,5,6-Trimethylbicyclo(2.2.1)hept-2-yl)cyclohex-1-ol 60%

[0029] Hexamethylenediamine 2-Hydroxy-5-sulfobenzoate 15%

[0030] Isopropanol 10%

[0031] Tetraethylene glycol 10%

[0032] Castor oil derivative 1%

[0033] Benzimidazole 1%

[0034] 6-quaternary ammonium salt fluorocarbon surfactant 1%

[0035] Acrylic 2%.

[0036] By mass percentage, the solder alloy powder is 92%, and the solder paste A is 8%.

[0037] The prepared solder paste was printed on the PCB board, reflowed, and the amount of tin beads and the spread of the large pad were observed. It was found that the amount of tin beads was very small and the large pad was uneven. Viscosity is 185pa.s when tested with a viscosity tes...

Embodiment 2

[0039] The solder alloy powder Sn3.0Ag0.5Cu was mixed with the solder paste B of the following composition (calculated by mass percentage) to make a solder paste, and its wettability and viscosity were tested.

[0040] The composition of solder paste B is as follows:

[0041] Nongrenylcyclohexanol 45%

[0042] phthalate-5-sulfonate 25%

[0043] Diethylene glycol 5%

[0044] Triethylene Glycol 17%

[0045] Polyethylene Glycol 3%

[0046] Benzimidazole 1%

[0047] 6-quaternary ammonium salt fluorocarbon surfactant 2%

[0048] Butadiene resin 2%.

[0049] In terms of mass percentage, the solder alloy powder is 85%, and the solder paste B is 15%.

[0050] The prepared solder paste was printed on the PCB board, and reflow soldering was performed, and the amount of tin beads and the spreading of the large pad were observed. It was found that the amount of tin beads was very small, and the large pad was wet. Viscosity is 140pa.s when tested with a viscosity tester.

Embodiment 3

[0052] The solder alloy powder Sn3.0Ag0.5Cu was mixed with the solder paste C with the following composition (calculated by mass percentage) to make a solder paste, and its wettability and viscosity were tested.

[0053] The composition of solder paste C is as follows:

[0054] Sandalwood Oil 40%

[0055] 5-Sulfo-salicylate 23%

[0056] Triethylene Glycol 15%

[0057] Glycerol 10%

[0058] Castor Oil Derivative 5%

[0059] Benzimidazole 1%

[0060] 18-quaternary ammonium salt fluorocarbon surfactant 2%

[0061] Nitrocellulose 4%.

[0062] In terms of mass percentage, the solder alloy powder is 90%, and the solder paste C is 10%.

[0063] The prepared solder paste was printed on the PCB board, and reflow soldering was performed, and the amount of tin beads and the spreading of the large pad were observed. It was found that the amount of tin beads was very small, and the large pad was wet. Viscosity is tested to be 170pa.s with a viscosity tester.

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Abstract

The invention discloses a rosin-free, lead-free and cleaning-free soldering paste containing activity control agent, which relates to material used for electronic packaging. The invention provides a rosin-free, lead-free and cleaning-free soldering paste containing activity control agent, which comprises lead-free alloy solder powder and paste flux, the mass percentages of which are as follows: 85to 92 percent of the lead-free alloy solder powder and 8 to 15 percent of the paste flux, wherein the paste flux consists of the activity control agent, active agent, thixotropic agent, antioxidant,surfactant, film forming agent and dissolvent. To solve the problem of activeness of the rosin-free solder paste, carboxylic acid with sulfo-group or organic compound containing sulfo-group is used asthe active agent, and simultaneously, the activity control agent which can lead the active agent to release activity slowly is added, thus causing the active agent to remarkably improve the wettability of the solder paste, without influencing the quality guarantee period of the solder paste.

Description

technical field [0001] The invention relates to a material for electronic packaging, in particular to a rosin-free, lead-free, no-cleaning solder paste which is used for mounting printed circuit boards and can control the slow release of active agent activity. Background technique [0002] With the rapid development of the electronics industry and the continuous updating of science and technology, the trend of miniaturization of electronic devices is becoming more and more obvious. Traditional welding wires and electrodes are increasingly unable to meet the requirements of miniaturization, and solder paste is currently widely used in the electronics industry. received more and more attention. [0003] The existing solder paste is composed of metal powder and creamy solder paste. The solder paste plays an important role in the solder paste. It is not only the carrier of the alloy powder, but also the active agent contained in the solder paste. Under high temperature, it can ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/363B23K35/26
Inventor 刘兴军王娟陈梁王翠萍马云庆张锦彬黄艺雄
Owner XIAMEN UNIV