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Process for producing printed wiring board and printed wiring board produced by the production process

一种印刷布线基板、制造方法的技术，应用在印刷电路制造、印刷电路、印刷电路等方向，能够解决铜布线短路、得不到高绝缘电阻等问题，达到高绝缘可靠性、工业效果大的效果

Active Publication Date: 2010-03-31
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009]However, when the above-mentioned two-layer plated substrate is etched using the above-mentioned etching solution, there is a case where etching residues are generated on the base metal layer such as Ni-Cr alloy Next, if the above-mentioned constant temperature and humidity bias test (HHBT) is carried out, there is a problem that the adjacent copper wiring is short-circuited by the etching residue of the above-mentioned Ni-Cr alloy layer, and high insulation resistance cannot be obtained, resulting in a problem that it becomes a defective product.

Method used

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  • Process for producing printed wiring board and printed wiring board produced by the production process
  • Process for producing printed wiring board and printed wiring board produced by the production process
  • Process for producing printed wiring board and printed wiring board produced by the production process

Examples

Experimental program
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Embodiment 1～5 and comparative example 1～5

[0093] Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples.

[0094] The Ni-Cr alloy film among the embodiment 1~5, comparative example 1~5 is to use 20% by weight Cr-Ni alloy target (Sumitomo metal Mining Co., Ltd.) was formed with a thickness of 20 to 30 nm by a direct current sputtering method (sputtering device: manufactured by Hirano Koson Co., Ltd.).

[0095] In addition, the copper films in Examples 1 to 5 and Comparative Examples 1 to 5 were formed on the polyimide film in the range of 100 to 120 nm by the DC sputtering method.

[0096] In each of the Examples and Comparative Examples, a predetermined alloy film, metal film, or copper film was separately formed on the polyimide film, so that the alloy film, metal film, or copper film The dissolution properties were evaluated.

[0097] Potassium permanganate was dissolved in ion-exchanged water with a composition shown in the following table to prepar...

Embodiment 6

[0108] Cut out a polyimide film (manufactured by Toray-DuPont Co., film thickness 50 μm) with a size of 12cm×12cm, and use a 7% by weight Cr-Ni alloy target (manufactured by Sumitomo Metal Mining Co., Ltd.) on one side, by DC sputtering A 7% by weight Cr—Ni alloy metal film was formed with a thickness of 20 to 30 nm using a sputtering apparatus: manufactured by Hirano Koson Co., Ltd. An evaluation sample of 50 mm×50 mm was cut out from the obtained alloy film-forming polyimide film. An aqueous solution prepared with 1% by weight of potassium permanganate and 5% by weight of acetic acid was heated to 40° C., and the evaluation sample was dipped for 2 minutes to visually confirm the degree of dissolution of the alloy film. As a result, the dissolution of the alloy film was observed.

Embodiment 7

[0110] In the same manner as in Example 6, a 30% by weight Cr—Ni alloy metal film was formed by direct current sputtering using a 30% by weight Cr—Ni alloy target (manufactured by Sumitomo Metal Mining Co., Ltd.). An evaluation sample of 50 mm×50 mm was cut out from the obtained alloy film-forming polyimide film. An aqueous solution prepared with 1% by weight of potassium permanganate and 5% by weight of acetic acid was heated to 40° C., and the evaluation sample was dipped for 2 minutes to visually confirm the degree of dissolution of the alloy film. As a result, the dissolution of the alloy film was observed.

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Abstract

The object of the invention is to provide a process for producing a printed wiring board, which can remove a residual metal among wirings at a low cost in a simple process without side etching of a copper layer and can realize satisfactory insulation reliability even in the case of a micro wiring product, and a printed wiring board produced by the production process. A process for producing a printed wiring board, comprising the step of forming a pattern by etching of a two-layer flexible substrate comprising an insulator film, a substrate metal layer provided directly on at least one side of the insulator film without through any adhesive and a copper film layer provided on the substrate metal layer, characterized in that the etching is carried out by a method comprising the step of etching the two-layer flexible substrate by a ferric chloride solution or a hydrochloric acid-containing cupric chloride solution, and the step of then treating the two-layer flexible substrate with an acidic oxidizing agent containing a permanganate and acetic acid.

Description

technical field [0001] The present invention relates to a method of manufacturing a printed wiring board as a raw material of electronic parts such as TAB tape and COF tape, and a printed wiring board obtained by the manufacturing method. More specifically, it relates to a two-layer flexible substrate by performing predetermined etching, In an inexpensive and simple process, metal residues between wirings can be removed without side etching of the copper layer, and a printed wiring board manufacturing method that can form a pattern with sufficient insulation reliability even in fine wiring processed products, and by A printed wiring board obtained by this manufacturing method. Background technique [0002] In general, substrates used for producing flexible wiring boards are roughly classified into three-layer flexible substrates in which copper foil as a conductor layer is bonded to an insulator film with an adhesive (for example, refer to Patent Document 1), and in this A ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06C23F1/18C23F1/26C23F1/28C23F1/30
CPCH05K2201/0761C23C22/58H05K2201/0338H05K3/26C23F1/18C23F1/28H05K3/067H05K2203/0796H05K3/388C23C22/52H05K3/06
Inventor 永尾晴美浅川吉幸池内研二
Owner SUMITOMO METAL MINING CO LTD