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fill fluid

A technology for filling liquid and droplets, which is applied to the device, application, coating and other directions of coating liquid on the surface, which can solve the problems of poor ejection of conductor patterns, poor ejection, and low concentration of surfactants.

Inactive Publication Date: 2011-12-14
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the dispersibility of a part of the metal particles may be lowered to cause aggregation or the like, resulting in poor ejection of the conductive pattern forming ink.
In addition, it has also been considered to use the conductive pattern forming ink to squeeze out the water and fill the conductive pattern forming ink without discharging the water, but in the vicinity of the interface between the water and the conductive pattern forming ink, the above-mentioned surfactant The parts with low concentration will result in poor ejection of the conductive pattern forming ink

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0235] [Preparation of filling liquid]

[0236] In the compounding amount shown in Table 1, mix ion-exchanged water, xylitol as sugar alcohol A, and OLFINE EXP4036 (manufactured by Nissin Chemical Industry Co., Ltd., containing 80% by weight) as surfactant A. acetylenic diol-based compound), thus, a filling liquid is obtained.

[0237] [Preparation of Ink for Conductive Pattern Formation]

[0238] 17 g of trisodium citrate dihydrate and 0.36 g of tannic acid were dissolved in 50 mL of alkaline water prepared by adding 3 mL of 10N-NaOH aqueous solution. To the obtained solution, 3 mL of a 3.87 mol / L silver nitrate aqueous solution was added, and stirred for 2 hours to obtain a silver colloidal solution. The obtained silver colloid was desalted by dialysis until the conductivity was 30 μS / cm or less. After dialysis, centrifugation was performed at 3000 rpm for 10 minutes to remove coarse metal colloid particles.

[0239] In this silver colloid, add xylitol as sugar alcohol B...

Embodiment 2

[0241] Except having used sorbitol as sugar alcohol A and sugar alcohol B, it carried out similarly to the said Example 1, and prepared the filling liquid and the ink for conductor pattern formation.

Embodiment 3

[0243] Except having used xylitol and maltitol as sugar alcohol A and sugar alcohol B, it carried out similarly to the said Example 1, and prepared the filling liquid and the ink for conductor pattern formation.

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Abstract

The present invention provides a filling liquid having excellent displaceability with ink for forming a conductor pattern. The filling liquid of the present invention is a filling liquid that is filled inside the droplet discharge device for storage of a droplet discharge device that discharges Provided is an ink for forming a conductor pattern in which metal particles are dispersed in an aqueous dispersion medium, wherein the filling liquid contains the above-mentioned aqueous dispersion medium, sugar alcohol A, and surfactant A. The filling liquid preferably contains the same type of sugar alcohol B contained in the conductor pattern forming ink. The surfactant A contained in the filling liquid preferably contains at least a part of the components constituting the surfactant B contained in the conductor pattern forming ink.

Description

technical field [0001] The invention relates to a filling liquid. Background technique [0002] As circuit boards (wiring boards) on which electronic components are mounted, widely used are circuit boards in which wiring made of a metal material is formed on a board made of ceramics (ceramic board). In the above-mentioned ceramic circuit board, since the board (ceramic board) itself is composed of a multifunctional material, it is advantageous in the formation of multilayered interior components, dimensional stability, and the like. [0003] The ceramic circuit board is produced by applying a combination of metal particles to a ceramic molded body made of a material containing ceramic particles and a binder in a pattern corresponding to the wiring (conductor pattern) to be formed. After that, degreasing and sintering are performed on the ceramic molded body to which the composition is applied. [0004] As a method of forming a pattern on a ceramic molded body, a screen pri...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41J2/165B05C11/10B41J2/19C09D11/00C09D11/326C09D11/38C09D11/52
CPCB41J2/16552H05K3/125H05K2203/0776H05K2203/013
Inventor 丰田直之
Owner SEIKO EPSON CORP