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Semiconductor single-wall thermal shrinkage pipe and preparation method thereof

A technology of heat-shrinkable tube and semi-conductive sheet, which is applied in the direction of cable joints, etc., to achieve the effect of low longitudinal shrinkage

Inactive Publication Date: 2011-08-31
江苏达胜热缩防护用品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, ordinary heat shrinkable tubes can no longer meet these requirements at the same time, which brings us a new topic, that is, it is necessary to develop a heat shrinkable tube that can not only be waterproof and sealed, but also have certain mechanical strength, good electrical properties and chemical properties. A new type of heat shrinkable product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] A semiconducting single-wall heat-shrinkable tube is composed of wall material, wherein the wall material is composed of 80 parts of polyolefin mixed resin, 10 parts of conductive carbon black, and 20 parts of auxiliary agent according to the parts by mass;

[0027] By mass percentage: the polyolefin mixed resin is a polyolefin mixed resin prepared by melt blending four kinds of polyolefin materials: 1-30% EVA630, 1-20% EVA421, 20-50% EVA283 and 10-30% EVA220 ;

[0028] The auxiliary agent is composed of paraffin, antioxidant, anti-copper agent, processing stabilizer and sensitizing cross-linking auxiliary agent; wherein the antioxidant tetrakis (β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionic acid) 1-3 parts of pentaerythritol; anti-copper agent MDA-1024 (hydroxyl-terminated polybutadiene acrylonitrile liquid rubber) 0.5-1 part; processing stabilizer rare earth composite stabilizer (REC-LS-D or REC-LS- F) 0.02-2 parts; 2-4 parts of smoke suppressant zinc borate; 1-2 p...

Embodiment 2

[0040] A semiconductive single-wall heat-shrinkable tube is composed of a wall material. According to the parts by mass, the wall material is composed of 80 parts of polyolefin mixed resin, 10 parts of conductive carbon black and 20 parts of auxiliary agent;

[0041] The polyolefin mixed resin is a polyolefin mixed resin prepared by melt blending four kinds of polyolefin materials of 15% EVA630, 20% EVA421, 45% EVA283 and 20% EVA220 by mass percentage; (β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate) is 1 part of pentaerythritol ester, anti-copper agent is 1 part of hydroxyl-terminated polybutadiene acrylonitrile liquid rubber, rare earth composite stabilizer (REC - 2 parts of LS-D or REC-LS-F), 3 parts of zinc borate as a smoke suppressant, 1 part of trimethylolpropane as a sensitizing cross-linking auxiliary agent, and the balance is paraffin;

[0042] A method for preparing a semiconducting single-wall heat-shrinkable tube,

[0043] A. Preparation of wall materials:

[...

Embodiment 3

[0053] A semiconductive single-wall heat-shrinkable tube is composed of a wall material. According to the parts by mass, the wall material is composed of 80 parts of polyolefin mixed resin, 10 parts of conductive carbon black and 20 parts of auxiliary agent;

[0054] The polyolefin mixed resin is a polyolefin mixed resin prepared by melt blending four kinds of polyolefin materials of 30% EVA630, 20% EVA421, 40% EVA283 and 10% EVA220 by mass percentage; (β-(3,5-di-tert-butyl-4-hydroxyphenyl) propionate) is 1 part of pentaerythritol ester, anti-copper agent is 1 part of hydroxyl-terminated polybutadiene acrylonitrile liquid rubber, rare earth composite stabilizer (REC - 2 parts of LS-D or REC-LS-F), 3 parts of zinc borate as a smoke suppressant, 1 part of trimethylolpropane as a sensitizing cross-linking auxiliary agent, and the balance is paraffin;

[0055] A method for preparing a semiconducting single-wall heat-shrinkable tube,

[0056] B. Preparation of wall materials:

[...

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Abstract

The invention relates to a thermal shrinkage pipe, in particular to a semiconductor single-wall thermal shrinkage pipe and a preparation method thereof. The semiconductor single-wall thermal shrinkage pipe is made of a wall material which comprises the following components in parts by mass: 80 parts of polyolefin mixed resin, 10 parts of graphitized carbon black and 20 parts of addition agent. The preparation method comprises the following steps of: preparing the wall material of the semiconductor single-wall thermal shrinkage pipe, extruding, irradiating, expanding and forming. Compared witha traditional shrinkage pipe, the invention has the technical characteristics that the outer layer of the thermal shrinkage pipe remains favorable electrical property, chemical property and other characters of a common thermal shrinkage pipe; in addition, the semiconductor single-wall thermal shrinkage pipe not only has all service performances of the common thermal shrinkage pipe, but also has the performance such as waterproofness, sealability, dampproofness, corrosion prevention, and the like.

Description

1. Technical field: [0001] The invention relates to a heat-shrinkable tube, in particular to a semiconductive single-wall heat-shrinkable tube and a preparation method thereof. 2. Background technology [0002] From the birth of heat shrinkable products to the present, the development speed can be said to be rapid, and the application field has been continuously expanded. At the beginning of the production of heat shrinkable products, they were mainly used for insulation protection, and now they are widely used in aviation, aerospace, ships, automobiles, home appliances, communications and petroleum. Chemical industry and other fields. Heat-shrinkable products play the role of sealing moisture-proof, waterproof, anti-corrosion and anti-vibration dislocation for cable joints and branches. Therefore, heat-shrinkable tubes are required to have good physical and electrical properties, such as wear resistance, anti-corrosion Impact resistance, high dielectric strength and other ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/08C08L9/02C08K13/02C08K3/04C08K3/38C08K5/053C08K5/134B29C69/02B29C71/04B29C61/02B29B7/72H02G15/18
Inventor 张志强庄向阳
Owner 江苏达胜热缩防护用品有限公司
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