Laser processing method and laser processing apparatus

Abstract

The present invention provides a laser processing method and a laser processing apparatus, capable of shortening the time of a protection film forming process of preventing debris caused by laser processing from bringing adverse effect before laser processing and a protection film removing process after laser processing, so as to ensure the quality and further improve manufacturing speed. When the surface of a wafer (1) is coated with water soluble resin (P) to form the protection film (P1) before laser processing, the coated resin (P) is blowed with warm wind to make the resin (P) to be vulcanized rapidly. Furthermore, when the wafer is washed to remove the protection film after laser processing, the cleaning fluid is heated and supplied to the protection film (P1) to accelerate the removing action, and the wafer (1) is blowed with warm wind to be dried rapidly after the protection film (P1) is removed.

Description

technical field [0001] The present invention relates to a laser processing technology for irradiating a workpiece such as a semiconductor wafer with laser light to perform groove processing or cutting processing, and particularly relates to coating a water-soluble resin on the processing surface of the workpiece held on a rotary table, and applying the coated technology for resin removal. Background technique [0002] In the manufacturing process of semiconductor devices, a large number of rectangular chip areas are divided by dividing lines arranged in a grid on the surface of a roughly disc-shaped semiconductor wafer, and ICs (integrated circuits: integrated circuits) are formed in these chip areas. integrated circuits) or LSI (large-scale integration: large-scale integrated circuits), and then, after performing necessary processing such as back grinding on the wafer, the wafer is cut along the planned dividing line to be divided, that is, diced, thereby Each chip region ...

AI Technical Summary

Problems solved by technology

However, in the case of laser dicing, there is a problem that when the laser beam is irradiated, droplets called debris (debris), which are vaporized components, adhere to the processing surface of the wafer, thereby deteriorating the quality.

Therefore, since the addition of these two processes before and after laser processing is not conducive to improving the manufacturing speed, it is necessary to seek improvement measures.

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