Lead-free and halogen-free environmental soldering paste for electronic industry

An electronic industry, lead-free soldering technology, applied in the direction of welding media, manufacturing tools, welding equipment, etc., can solve the problems of ion pollution, solder paste printing performance, unsatisfactory storage, weak mechanical strength of solder joints, etc. Achieve good electrical insulation, good film-forming performance, and high-quality effects

Active Publication Date: 2010-06-16
惠州市成利工业有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

And if the solder joints containing halogens are placed in the air for a long time, the mechanical strength of the solder joints will weaken, and ion pollution will cause some potential short circuit risks.
In addition, the current solder paste printing performance and storage are not ideal

Method used

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  • Lead-free and halogen-free environmental soldering paste for electronic industry
  • Lead-free and halogen-free environmental soldering paste for electronic industry

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Experimental program
Comparison scheme
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Embodiment Construction

[0024] The formula of halogen-free flux in each embodiment of the present invention is shown in Table 1:

[0025] Table 1 (in terms of total weight percentage of halogen-free flux)

[0026]

[0027] The proportioning of lead-free solder powder and halogen-free flux described in each embodiment of the present invention is shown in Table 2:

[0028] Table 2 (based on the total weight percentage of lead-free and halogen-free environmentally friendly solder paste for the electronics industry)

[0029]

[0030] The preparation method of lead-free halogen-free environment-friendly solder paste for electronic industry of the present invention is carried out according to the following steps:

[0031] 1. Add the resin and the resin additive into the reactor, heat and stir until completely melted. After melting, adjust the temperature to 150°C-200°C and keep it for 10 minutes, let it cool down slowly and uniformly, Add activator, thixotropic agent, stabilizer, antioxidant and so...

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Abstract

The invention discloses a lead-free and halogen-free environmental soldering paste for the electronic industry. The soldering paste comprises 80wt%-95wt% of lead-free soldering tin powder and 5wt%-20wt% of halogen-free soldering flux, wherein the halogen-free soldering flux comprises 5wt%-15wt% of activator, 32wt%-50wt% of resin, 3wt%-10wt % of resin additive, 2wt%-10wt% of thixotropic agent, 1wt%-15wt% of stabilizer, 0.5wt%-8wt% of antioxidant and the balance solvent; the activator adopts the salt prepared from organic acid and amine to replace traditional halogen salt and adopts phenolic modified rosin ester and triisocyanate to replace part of traditional resin which is largely used, the lead-free and halogen-free environmental soldering paste for the electronic industry does not contain lead and halogen, is safe and environmentally friendly and has good welding performance, electrical performance, printing performance and storability.

Description

technical field [0001] The invention relates to a no-cleaning solder paste for the electronic industry, in particular to a lead-free and halogen-free environmentally friendly solder paste. Background technique [0002] With the rapid development of electronic products, the pursuit of smaller, lighter, higher performance, and more environmentally friendly consumer electronics has become the pursuit of more and more people. The previous THT (Through Hole Technology, through-hole assembly technology) has gradually Replaced by SMT (Surface Mount Technology, Surface Mount Technology). Since the traditional solder paste products are composed of tin-lead solder powder and flux, the heavy metal lead in the solder paste will enter the living environment of people after the product is discarded after soldering the PCB. Reacting with various chemical substances in the environment, lead will seep into the groundwater or be absorbed by plants. When people drink polluted water bodies and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/24B23K35/40
Inventor 苏明斌苏传港苏燕旋苏传猛晏和刚谢明贵何繁丽
Owner 惠州市成利工业有限公司
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