Method for manufacturing back contact solar energy batteries
A technology for solar cells and manufacturing methods, applied in final product manufacturing, sustainable manufacturing/processing, circuits, etc., can solve problems such as high technical cost and difficulty in implementing P-type diffusion technology, and achieve process simplification, easy implementation, and cost reduction. Effect
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[0029] Specific examples, such as image 3 As shown, the process flow includes steps:
[0030] Step 1, silicon wafer cleaning, surface texture:
[0031] Zone-melting N-type monocrystalline silicon wafers with a thickness of 220-280um are selected as the base material, and the silicon wafers are cleaned with a NaOH solution with a mass fraction of 2%-15% and a temperature between 60°C and 90°C to remove the silicon wafers. The surface is damaged, and the front side of the silicon wafer is made into an inverted pyramid suede with a mixed solution of KOH and IPA (isopropanol).
[0032] Step 2, growing a P-type doped silicon dioxide layer:
[0033] A P-type doped layer is grown on the back of the substrate. The doping source can be boron or other P-type dopants. The P-type doped layer can be deposited by conventional techniques such as atmospheric pressure chemical vapor deposition and plasma enhanced chemical vapor deposition. Deposited by various deposition methods, the thick...
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