Packaging structural element of dye-sensitized cell and packaging method thereof

Abstract

The invention discloses a packaging structural element of dye-sensitized cell and a packaging method for preparing the packaging structural element of dye-sensitized cell; the dye-sensitized cell comprises a photocathode component, a counter electrode component and an electrolyte (8) packaged together; the packaging structural element is characterized in that the packaging structural element combined with two or more layers is covered on the surface of the conductive electrode (5) in the photocathode component and / or the counter electrode component, wherein the packaging structural element combined with two or more layers at least comprises a rigid insulation layer (6) covered on the surface of the conductive electrode (5) and a binder bonding layer (7) covered on the surface of the rigid insulation layer (6). In the packaging structural element combined with two or more layers, the defects of material in the prior art are avoided, thereby solving the technical problem of short circuit due to the easily deforming of the bonding layer at high temperature and pressure which makes the bonding layer become thinner, and the conductive electrodes of the photocathode and the counter electrode have contact points.

Description

technical field [0001] The invention relates to a packaging structure and packaging method of a dye-sensitized battery, in particular to a packaging structure with a hard insulating layer covering the surface of a conductive electrode and an adhesive coating covering the surface of the hard insulating layer. This two-layer or multi-layer dye-sensitized battery packaging structure of the binder adhesive layer, and a preparation method related to such a dye-sensitized battery packaging structure. Background technique [0002] Energy shortage and environmental pollution are two major problems facing mankind at present. Traditional energy sources such as coal, oil and wood can only last for fifty to one hundred years at the current rate of consumption. In addition, the resulting environmental pollution is also threatening the earth on which human beings depend for survival. In the future that can be predicted by human beings, solar energy, as an inexhaustible clean energy sour...

AI Technical Summary

Problems solved by technology

[0006] Disadvantages of the encapsulation process of the patent CN101515509A: the stability of the sarin film encapsulation process is poor, and it is very easy to cause encapsulation failure in the case of contact with the electrolyte, resulting in electrolyte leakage and battery failure

In addition, sarin film is expensive (such as Surlyn1702 heat-sealing film is about 1,000 yuan / square meter), and the cutting and laying process of surlyn film is not suitable for automatic production. In addition, the lamination process of surlyn film has relatively low stability and uniformity. Poor, not conducive to industrial production

[0007] Disadvantages of the packaging process of the patent CN101354970A: it is difficult to ensure the tightness of each contact point during the sintering of the glass paste, because it is difficult to maintain a uniform thickness of the glass paste after screen printing, and it is easy to apply pressure on the glass during the sintering process. cause glass to deform

In addition, there are also a small number of holes after the glass paste is sintered, which easily leads to leakage and volatilization of the electrolyte

[0008] It can be seen that the prior art is generally a single-layer encapsulation structure on the conductive electrode. Some use Surlyn1702 heat-sealing film alone, some use glass paste alone, and some use special adhesive alone, but the prior art exists certain shortcomings

For example, Surlyn1702 heat-sealing film has disadvantages such as poor stability and solvent resistance, difficulty in automation, and high cost; glass paste has disadvantages such as difficulty in ensuring the uniformity of packaging, and some upper and lower packaging points cannot be in good contact, which leads to electrolyte leakage

The disadvantage of easy short circuit when using adhesive alone is that the adhesive is easily deformed under high temperature and pressure, so that the adhesive layer becomes thinner, resulting in a contact point between the photoanode and the conductive electrode on the counter electrode, resulting in short circuit

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