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Sn-Ag-Cu-Zn-Ge lead-free solder for inhibiting solid-state interface reaction and preparation method thereof

An interface reaction, lead-free solder technology, used in manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems affecting interface reliability, substrate dissolution, etc., to achieve inhibition of solid-state reaction, reduction of corrosion, and good wetting. sexual effect

Inactive Publication Date: 2010-08-04
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

It solves the disadvantages in the prior art that the solder is easy to react with the metal of the substrate, causing a large amount of dissolution of the substrate, and at the same time a large amount of intermetallic compounds are formed at the interface, which seriously affects the reliability of the interface. The preparation process of the lead-free solder of the present invention is simple and easy to produce change

Method used

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  • Sn-Ag-Cu-Zn-Ge lead-free solder for inhibiting solid-state interface reaction and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The components and mass percentages in this embodiment are: Ag 3.5%, Cu 0.7%, Zn 0.2%, Ge 0.1%, Sn balance. First, put the Sn particles into the KCl+LiCl eutectic protective salt melt at 400°C, and raise the temperature to 600°C, add high-purity Ag wire and Cu wire, keep warm for 2-4 hours, and stir well to obtain a uniform Sn- TM solution; then, add a small amount of Zn foil and Ge particles to the alloy solution, keep warm for 2 hours, and stir well. After that, the temperature was lowered to 300°C and poured into stainless steel molds.

[0024] 100 mg of the smelted solder was prepared into a Sn-Ag-Cu-0.2Zn-0.1Ge / Cu brazing joint, and an aging test was carried out. The microstructural evolution of the interface was observed by scanning electron microscopy, and the thickness of the compound layer at the reaction interface was analyzed. The thickness of the compound layer is shown in Table 1.

Embodiment 2

[0026] The components and mass percentages in this embodiment are: Ag 3.5%, Cu 0.7%, Zn 1%, Ge 0.1%, Sn balance. First, put the Sn particles into the KCl+LiCl eutectic protective salt melt at 400°C, and raise the temperature to 600°C, add high-purity Ag wire and Cu wire, keep warm for 2-4 hours, and stir well to obtain a uniform Sn- TM solution; then, add a small amount of Zn foil and Ge particles to the alloy solution, keep warm for 2 hours, and stir well. After that, the temperature was lowered to 300°C and poured into stainless steel molds.

[0027] 100 mg of the smelted brazing filler metal was prepared into a Sn-Ag-Cu-1.0Zn-0.1Ge / Cu brazing joint, and an aging test was carried out. The microstructural evolution of the interface was observed by scanning electron microscopy, and the thickness of the compound layer at the reaction interface was analyzed. The thickness of the compound layer is shown in Table 1.

Embodiment 3

[0029] The components and mass percentages in this embodiment are: Ag 3.5%, Cu 0.7%, Zn 2%, Ge 0.1%, Sn balance. First, put the Sn particles into the KCl+LiCl eutectic protective salt melt at 400°C, and raise the temperature to 600°C, add high-purity Ag wire and Cu wire, keep warm for 2-4 hours, and stir well to obtain a uniform Sn- TM solution; then, add a small amount of Zn foil and Ge particles to the alloy solution, keep warm for 2 hours, and stir well. After that, the temperature was lowered to 300°C and poured into stainless steel molds.

[0030] 100 mg of the smelted brazing filler metal was prepared into a Sn-Ag-Cu-2.0Zn-0.1Ge / Cu brazing joint, and an aging test was carried out. The microstructural evolution of the interface was observed by scanning electron microscopy, and the thickness of the compound layer at the reaction interface was analyzed. The thickness of the compound layer is shown in Table 1.

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Abstract

The invention relates to an Sn-Ag-Cu-Zn-Ge lead-free solder for inhibiting solid-state interface reaction and a preparation method thereof for the technical field of electronic packaging. The solder comprises the following components in mass percent: 0%-3.5% of Ag, 0%-0.7% of Cu, 0%-2% of Zn, 0%-0.3% of Ge and balance of Sn. The preparation method comprises the following steps: firstly, putting Sn particles into a KCl and LiCl eutectic protection salt solution, heating, adding high-purity Ag wires and / or Cu wires, insulating for the first time, and fully stirring to obtain a uniform Sn-TM solution; then, adding trace Zn foil and / or Ge particles into the alloy solution, insulating for the second time, and fully stirring; and cooling and pouring the solution into a solder mold. The invention solves the problems that in the prior art, because the lead-free solder has high Sn content, the lead-free solder can react with substrate metals easily, thereby causing a large amount of substrates to be dissolved, and simultaneously, a large amount of intermetallic compounds are formed on the interface, thereby seriously influencing the reliability of the interface. The lead-free solder of the invention has simple preparation processes and can be prepared in batch easily.

Description

technical field [0001] The invention relates to a solder used in the technical field of electronic packaging and a preparation method thereof, in particular to a Sn-Ag-Cu-Zn-Ge lead-free solder capable of suppressing solid-state interfacial reactions and a preparation method thereof. technical background [0002] SnPb is a traditional electronic packaging material. Due to the great threat of Pb to the natural environment and human health, countries around the world have legislated to gradually abandon SnPb solder. Therefore, seeking a substitute for SnPb eutectic solder has become an important task in the current electronics industry. So far, countries around the world have successively developed a series of lead-free solders, which are mainly based on Sn-Ag, Sn-Cu, Sn-Ag-Cu, Sn-Zn, Sn-Bi eutectic systems. . However, even the most promising Sn-Ag-Cu eutectic or near-eutectic solders have many properties that are difficult to compare with SnPb eutectic solders. [0003] Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
Inventor 陆皓余春杨扬陈俊梅胡月胜
Owner SHANGHAI JIAO TONG UNIV
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