Manufacturing method for integral LED light source module

Abstract

The invention relates to a manufacturing method for an integral LED light source module. The manufacturing method comprises the following technological steps that: a metal substrate is precut; an LED support is manufactured on the metal substrate through plastic encapsulation; chips are placed in the LED support one by one through adhesive dispensing and die bonding, and the electrodes of the chips are connected with the electrode pin of the LED support through pressure welding and routing; adhesive is injected to encapsulate and protect the LED chips and the routing; precut connecting parts on the two sides of the LED support are punched to be cut to form an integral LED light source assembly; an integral test is conducted to all LED light emitting elements; and finally punching discretion is conducted to obtain the required integral LED light source module according to the required series and parallel circuits and the number of the LED light emitting elements. The invention properly uses the metal substrate as the base material, uses high-reflectivity plastics to be combined with the metal substrate for series and parallel circuit connection to manufacturing the integral LED light source module, omits the manufacturing process of pin bending and semi-discretion and the tape armoring and the manufacturing process of the existing SMT on the basis of the existing SMD manufacturing process, and greatly shortens the manufacturing process of the elements.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a method for manufacturing an integral LED light source module. Background technique [0002] At present, a general LED light source module consists of several LED chips welded on the substrate by patch or plug-in. The power of a single LED light-emitting element is 0.03-5W. The substrate is a PCB board, a flexible PCB board or aluminum, copper, etc. Metal substrates made of metal materials; or LED chips directly packaged on various substrates, commonly known as COB (chips on board). The above-mentioned substrates for fixing LED chips are designed with a heat dissipation structure, usually an aluminum substrate plus an aluminum profile heat sink, plus natural heat dissipation, air cooling or heat pipe heat dissipation, and semiconductor refrigeration for heat dissipation. [0003] figure 1 The production process of LED light-emitting components is given in , the main steps include...

AI Technical Summary

Problems solved by technology

The above-mentioned entire production process is complicated, and the production and material costs are high. The substrate board used to make the LED light-emitting element can only be used as a disposable product, and it will be discarded after taking out the LED light-emitting element, resulting in a lot of waste of resources.

If the COB method is used, it is difficult to uniformize the coating of phosphor powder on the chip, and its light effect and color temperature are difficult to be consistent and controlled.

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