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Silicon controlled thyristor device micro slot group composite phase change integrated cooling heat dissipation method and device

A technology of composite phase change and heat dissipation method, which is applied in the direction of electrical components, thyristors, electric solid devices, etc., and can solve problems such as low efficiency, poor heat extraction capacity, and high cost

Inactive Publication Date: 2010-08-25
INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to: solve the low safety reliability, poor heat extraction capacity, insufficient heat dissipation capacity, low efficiency and high energy consumption of the existing high-power thyristor power electronic equipment heat dissipation technology (requiring a high-power water pump or a high-power fan ), complex and expensive system devices, high noise, short operating life, high operation and maintenance costs, many consumables for heating devices and need to occupy a large functional space of thyristor power electronic equipment, and technical shortcomings of poor temperature control performance; Thereby, a microgroove group composite phase change integrated cooling and heat dissipation method and device of a thyristor device are provided. The device has high safety and reliability, a small area (matching with the size of the thyristor device), high heat flux density, and high temperature control. capability, high isothermal performance, high efficiency and low energy consumption, and an integrated heat-taking mode that adapts to multiple high-power heating devices (single thyristor power is above the kilowatt level), and at the same time, can meet and improve high-power thyristor power electronic equipment Requirements for the working temperature of each thyristor, with a strong heat dissipation capability

Method used

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  • Silicon controlled thyristor device micro slot group composite phase change integrated cooling heat dissipation method and device
  • Silicon controlled thyristor device micro slot group composite phase change integrated cooling heat dissipation method and device
  • Silicon controlled thyristor device micro slot group composite phase change integrated cooling heat dissipation method and device

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Effect test

Embodiment 1

[0084] Below in conjunction with accompanying drawing and embodiment the present invention is described in detail:

[0085] Refer to Figure 4 for the forced water-cooling mode micro-groove group composite phase change integrated cooling rectifier cooling system. For the rectifier power electronic equipment composed of 6 high-power thyristor components, a thyristor device at the cold end of the forced water-cooling mode is produced. Microgroove group composite phase change integrated cooling system. It includes a vacuumized micro-groove group composite phase-change heat collector 2 for taking heat from the heat-generating surfaces on both sides of the thyristor 1 . Each thyristor 1 is provided with two micro-groove composite phase-change heat extractors 2, each taking heat from one side of the thyristor 1. The 6 thyristors 1 forming the thyristor rectifier cabinet device are provided with 12 micro-groove composite phase-change heat extractors 2 in total. Each microgroove grou...

Embodiment 2

[0090] Refer to Figure 5 for the forced air cooling mode micro-groove group compound phase change integrated cooling rectifier cabinet heat dissipation system, for the rectifier cabinet power electronic equipment composed of 6 high-power thyristor components, a thyristor device at the cold end of the forced air cooling mode is produced Microgroove group composite phase change integrated cooling system. In Embodiment 1, the wall condenser 4 whose cold end is water-cooled mode is replaced with the wall condenser 4 whose cold end is air-cooled mode, as shown in FIG. 2b. The outer wall of the wall condenser 4 in air-cooled mode at the cold end is provided with vertical rectangular rib groups 22, the height of the rectangular fins is 10mm, the thickness of the fins is 2mm, and the spacing between the fins is 4mm; the cold end is in the air-cooled mode The wall condenser 4 is installed in the air duct away from the working space of the thyristor 1. Two fans 18 with a power of 50W ar...

Embodiment 3

[0092] Refer to Figure 6 for the air natural convection mode micro-groove group composite phase change integrated cooling rectifier cabinet cooling system, for the rectifier cabinet power electronic equipment composed of 6 high-power thyristor components, a controllable air natural convection mode cold end controllable Micro-groove group composite phase change integrated cooling and heat dissipation system for silicon devices. The wall condenser 4 adopts the wall condenser 4 in the air-cooled mode at the cold end in Embodiment 2, as shown in FIG. 2b. A vertical rectangular fin group 22 is arranged on the outer wall of the wall condenser 4 in the air-cooled mode at the cold end, the height of the rectangular fins is 20 mm, the thickness of the fins is 2 mm, and the spacing between the fins is 3 mm; the cold end is in the air-cooled mode The wall condenser 4 is installed in the external environment away from the working space of the thyristor 1, and the fan and air duct device i...

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Abstract

The invention provides a silicon controlled thyristor micro slot group composite phase change integrated cooling heat dissipation method and device, relating to the heat dissipation technology. The method includes that micro dimension composite phase change heat transfer characteristic of thin liquid film evaporation and thick liquid film boiling of liquid in open composite phase change micro slot group in a micro slot group composite phase change heat remover is utilized to remove heat. The device is provided with a micro slot group composite phase change heat remover at the two sides of single silicon controlled thyristor respectively, the silicon controlled thyristor removes heat in multiple groups, each group is provided with a wall type condenser heat dissipation structure, heat emitted by each silicon controlled thyristor can be taken out respectively and is carried into the wall type condenser by steam, condensation heat dissipation is carried out in condensation micro slot thereof, heat is taken away by external cooling water or air, condensed liquid reflows to the micro slot group composite phase change heat remover, and heat dissipation of silicon controlled thyristor with high power, large quantity and strong electric field is realized. The invention is safe and reliable, has small area, high heat-flow density, strong temperature control capability, high efficiency and low energy consumption and can be applicable to integrated cooling heat dissipation of a plurality of high power heat-emitting silicon controlled thyristors.

Description

technical field [0001] The invention relates to the field of heat dissipation technology, and is a microgroove group composite phase change integrated cooling and heat dissipation method and device for a silicon controlled rectifier device, which is applied to a variety of ultra-high power devices composed of multiple high-power silicon controlled silicon (thyristor) power electronic devices. Heat dissipation and thermal control system of power electronic equipment. Background technique [0002] Different from the well-known low-power electronic devices in the weak current field used for signal transmission and information exchange such as computers and televisions, power electronic devices refer to power electronic devices used in the electric field (strong electric field) to control and transform electric energy. Usually refers to high-power electronic devices with currents up to thousands of amperes and voltages of thousands of volts. It adapts to the electricity require...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34H01L23/427H01L23/467H01L29/74
Inventor 胡学功唐大伟
Owner INST OF ENGINEERING THERMOPHYSICS - CHINESE ACAD OF SCI
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