Phenylo boric acid-silane-ethynyl polymer and preparation method thereof
A technology of phenylboronic acid and ethynyl, which is applied in the field of phenylboronic acid-silane-ethynyl polymer and its preparation, can solve problems such as thermal rearrangement degradation, and achieve the effects of convenient operation, abundant sources, and simple synthesis process
Inactive Publication Date: 2010-09-15
EAST CHINA UNIV OF SCI & TECH
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Abstract
The invention discloses phenylo boric acid-silane-ethynyl polymer and a preparation method thereof. The polymer is prepared by taking dihalo-silane, phenylo boric acid, trichloroethylene and organic lithium as raw materials in three-step reaction under the protection of inert gas. In the first step, the phenylo boric acid and the dihalo-silane react to form a polymer with a silane-phenylo boric acid-silane repetitive structure and halogen-sealed end. In the second step, the trichloroethylene and the organic lithium react to form an ethynyl dilithium. Finally, the ethynyl dilithium and the polymer formed in the first step generate coupling reaction to obtain the final product after hydrolyzation. The used raw materials are easy to obtain, the process flow is simple, and the operation process is feasible. The prepared polymer generates crosslinking reaction to form thermosets with good high temperature resistance and thermal oxidation resistance property under the thermal or chemical initiation, and is further heated to form a ceramic structure. The prepared polymer can be used as matrix resin, high temperature-resistance coating and ceramic precursor of the advanced composite material.
Description
technical field The invention relates to a high-temperature-resistant and thermal-oxidation-resistant polymer, in particular to an organic-inorganic hybrid polymer containing boron, silicon and acetylene groups in the main chain, and the main chain is composed of Si-O-B and C≡C. The ethynyl group undergoes a curing crosslinking reaction under the action of light, heat or an initiator to form a three-dimensional network structure, and further forms a ceramic structure under the action of high temperature. Background technique Silicone resin is a polymer with Si-O-Si bond as the main molecular chain and organic groups connected to silicon atoms. Its structure contains both organic groups and inorganic structures. This special composition and molecular structure make it a combination of organic properties and inorganic functions, with unique physical and chemical properties, such as excellent heat resistance, cold resistance, electrical insulation and weather resistance, and ar...
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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/50
Inventor 周权倪礼忠程睿
Owner EAST CHINA UNIV OF SCI & TECH
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