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Glass substrate etching solution and preparation method thereof

A technology of etching solution and glass, which is applied in the field of glass substrate etching solution and its preparation, can solve the problems of low utilization rate of etching solution, easy volatilization, unstable etching rate, etc., and achieve the problem of insoluble by-products, strong biodegradable The effect of improving the etching effect

Active Publication Date: 2012-06-27
HEFEI MAOTENG ENVIRONMENTAL PROTECTION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When there is hydrofluoric acid in the etching solution, there will be the following problems: 1. Hydrofluoric acid is highly toxic and easy to volatilize, especially when it needs to be prepared at a higher temperature and concentration. The environment causes huge pollution; 2. The by-products produced by etching are easily adsorbed on the surface of glass, equipment and pipelines, causing problems such as poor product surface treatment and pipeline blockage, which affects the yield rate; 3. The etching rate is unstable during the production process, and the etching The utilization rate of the liquid is relatively low, which will also cause a large amount of waste liquid treatment, and the treatment cost will also increase accordingly.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Stir the components in the following percentages by weight evenly at 20-30° C. (room temperature) to obtain the etching solution for flat glass thinning provided by the present invention: 5% ammonium fluoride, 20% sulfuric acid, 1% NTA, and 74% pure water.

[0020] The etching performance of the etching solution for thinning flat glass is determined according to the following method:

[0021] After cleaning the TFT glass substrate with a width of 300mm, a length of 300mm, and a thickness of 0.7mm, put it upright in an etching basket, and then completely soak it in a temperature-controlling basket filled with the etching solution for thinning flat glass provided by the present invention. In the container of the device, keep the temperature at 25-30°C, etch for 30 minutes under the condition of an etching rate of 1.5 μm / min, take out the glass, rinse it with deionized water, after cleaning, finally rinse it with deionized water and dry it. The thickness of the TFT glass s...

Embodiment 2

[0023] Stir the components in the following percentages by weight evenly at 20-30°C (room temperature) to obtain the etching solution for flat glass thinning provided by the present invention: 5% ammonium fluoride, 30% sulfuric acid, 1% NTA, and 64% pure water.

[0024] Measure the etching performance of this flat glass thinning etchant according to the method identical with embodiment 1, only change etching rate into 2.5 microns / minute, after etching, measure and find that the thickness of this TFT glass substrate is 0.625mm, It can be seen that the thickness non-uniformity of the TFT glass substrate is less than 1%, and a small amount of white flocculents are produced in the container containing the etching solution, which is easy to remove.

Embodiment 3

[0026] Stir the components in the following percentages by weight uniformly at 20-30°C (room temperature) to obtain the etching solution for flat glass thinning provided by the present invention: 5% ammonium fluoride, 40% sulfuric acid, 1% NTA, 54% pure water.

[0027] Measure the etching performance of this flat glass thinning etchant according to the method identical with embodiment 1, only change etching rate into 5 microns / minute, after etching, measure and find that the thickness of this TFT glass substrate is 0.55mm, It can be seen that the thickness non-uniformity of the TFT glass substrate is less than 1%, and a small amount of white flocculents are produced in the container containing the etching solution, which is easy to remove.

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Abstract

The invention discloses a glass substrate etching solution and a preparation method thereof. The etching solution is prepared from the following components in percentage by weight: 5-20 percent of ammonium fluoride, 20-60 percent of strong acid, 1-8 percent of triglycolamic acid and the balance of water. The etching solution is safe, stable, high-efficiency and low-cost and can favorably prevent slightly soluble product from being generated in an etching process, the etching velocity and the etching effect are improved, and the environmental pollution is suitably lessened. The etching solution is suitable for thinning TFT (Thin-Film Transistor) glass substrates, glass substrates for LCD (Liquid Crystal Display), glass substrates for TP (Touch Panel) display, glass substrates for PDP (Plasma Display Panel) display and glass substrates for OLED (Organic Light-Emitting Diode) display.

Description

technical field [0001] The invention belongs to the field of flat panel display, in particular to a glass substrate etching solution and a preparation method thereof. Background technique [0002] In the field of flat panel display, including liquid crystal display (LCD), touch screen (TP), plasma display (PDP) and organic electroluminescence (OLED) and other preparation processes, due to the limitation of glass substrate production process, in order to further reduce the To reduce the weight of the display device, more and more manufacturers adopt the method of thinning the glass substrate. [0003] There are two commonly used thinning methods, one is the physical method, that is, polishing and grinding with polishing powder, this method takes a long time to thin, the precision is not easy to control, and the product yield is low; the other method is the chemical etching method , This method has short thinning time, low equipment investment, high product yield, and the com...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C15/00
Inventor 冯卫文
Owner HEFEI MAOTENG ENVIRONMENTAL PROTECTION TECH CO LTD