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Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof

A technology for printed circuit boards and epoxy adhesives, applied in the directions of adhesives, epoxy resin adhesives, carboxyl rubber adhesives, etc., can solve the problems of energy saving and consumption reduction, easy to carry static electricity, and high curing temperature of the encapsulation film

Active Publication Date: 2010-09-29
华烁电子材料(武汉)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high curing temperature of the encapsulation film not only easily causes defects such as unevenness, static electricity, and poor dimensional stability of the product, but also increases the probability of bubbles during product curing, resulting in more defective products
In addition, it also has a negative impact on energy saving and consumption reduction.

Method used

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  • Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof
  • Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof
  • Intermediate temperature-cured epoxy adhesive for coverlay of flexible printed circuit and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Add proportioning amounts of p-phenylenediamine, maleic anhydride and N,N-dimethylformamide into a 2500mL container, stir and react at 80°C for 3 hours, and cool to room temperature to prepare a polyamide curing agent. Weigh liquid carboxylated nitrile rubber CTBN and solid carboxylated nitrile rubber 1072 according to the ratio and dissolve them at a concentration of 10% to 20% by mass. After the rubber is completely dissolved, filter through a 300-mesh filter for use.

[0023] Add the proportioned amount of epoxy resin, nitrile rubber, inorganic filler, polyamide curing agent and solvent into a 50L container, stir evenly at room temperature for 3 to 5 hours to form a uniform mixed solution, and filter through a 200-mesh filter After removing a small amount of impurities, it is formulated as an adhesive for medium temperature curing epoxy encapsulation film. Coat the adhesive on the polyimide film with a coating machine, and form a dry glue of 25 μm after baking in the...

Embodiment 2

[0025] According to the proportion of Example 2 in Table 1, the adhesive for medium-temperature epoxy encapsulation film, encapsulation film, and FPC samples were prepared according to the method of Example 1, and the performance test results are shown in Attached Table 2.

Embodiment 3

[0027] According to the proportioning of Example 3 in Table 1, according to the method of Example 1, an adhesive and an encapsulation film for a medium-temperature epoxy adhesive encapsulation film were prepared, and after fast pressing with the copper surface of a flexible copper-clad laminate, after 140 ± 2 ℃, baked for 90 minutes to make FPC samples, performance test results are shown in Table 2.

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Abstract

The invention provides an intermediate temperature-cured epoxy adhesive for a coverlay of a flexible printed circuit and a preparation method thereof. The adhesive comprises the following main components: liquid epoxy CYD-128, solid epoxy CYD-014, liquid carboxy terminated nitrile rubber CTBN, solid carboxy terminated nitrile rubber 1072, a versamid intermediate temperature curing agent, and one or more inorganic fillers, wherein the intermediate temperature curing agent is a core component of the epoxy adhesive, and is synthesized by reacting diamine with diacid or di-anhydride in a polar solvent at the temperature of between 10 and 80 DEG C, wherein the molar ratio of the diamine to the diacid or di-anhydride is 0.25-4, and the polar solvent accounts for 50 to 90 mass percent of the reactants. The epoxy coverlay prepared from the adhesive can be completely cured at the temperature of between 135 and 145 DEG C, and the curing time is 60 to 120 minutes. The sample has the peel strength of over 1.0N / mm, good soldering resistance, small color change and low water absorption.

Description

technical field [0001] The invention relates to a medium-temperature curing epoxy adhesive for a flexible printed circuit board encapsulation film and a preparation method thereof. The adhesive is mainly used on a flexible printed circuit board and belongs to the application field of polymer materials. technical background [0002] Coverlay is the outer protective material of Flexible Printed Circuit (FPC), which is used to protect the circuit without special treatment from environmental and human factors. The encapsulation film is generally composed of three layers of materials: a layer of insulating film as the base film, and the commonly used insulating base film is polyimide film (PI film); the middle layer is the adhesive film; the third layer is the release film for the protective film. type material. The adhesive film of the middle layer is the core part of the development of encapsulation film products, and commonly used adhesive films include epoxy adhesive film an...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J113/00C09J109/02C09J11/08C09J7/02H05K1/02
Inventor 范和平李桢林
Owner 华烁电子材料(武汉)有限公司
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