Preparation method of laser diode packaging case

A technology of laser diodes and encapsulation shells, applied in lasers, laser parts, semiconductor lasers, etc., can solve problems such as difficulty in achieving production, difficult stamping processing, and failure to meet product requirements.

Inactive Publication Date: 2010-11-17
湖北讯科光电封装技术有限公司
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

Since the metal boss 2' on the metal bottom plate 1' is processed by stamping and forming the metal bottom plate, the positioning processing accuracy, verticality and smoothness of the metal boss 2' on the bottom plate 1 from the center line of the metal bottom plate require stampi

Method used

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  • Preparation method of laser diode packaging case
  • Preparation method of laser diode packaging case
  • Preparation method of laser diode packaging case

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Embodiment Construction

[0024] Such as figure 2 Shown is a schematic structural view of a laser diode prepared by the present invention, which consists of a stem 10 and a cap 20 . Described socket 10 (as image 3 shown) including base plate 1 (as Figure 5A , Figure 5B shown), glass insulator 2, lead wire 3; described cap 20 (such as Figure 4 Shown) comprises cover shape round metal shell 4, glass lens 5 and low temperature glass 6.

[0025] The present invention is a kind of preparation method of laser diode packaging shell, and it comprises the following steps:

[0026] (1) Cleaning treatment before sintering: (11) Ultrasonic cleaning: place the base plate 1 and the lead wire 3 in an ultrasonic cleaning solution for ultrasonic cleaning, the function is to eliminate the product performance difference caused by pollutants in the subsequent process; ( 12) Oxidation treatment: Mix nitrogen and water in the oxidation furnace to form mouse gray on the surface, in order to make the metal and glass...

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Abstract

The invention discloses a preparation method of a laser diode packaging case, which comprises the following steps of: cleaning before sintering, and sintering, fusing and sealing a diode seat; fixing the form of a product; electroplating, and pretreating a diode cap for sintering; sintering, fusing and sealing a diode cap, and plating the bell-shaped round metal case; and assembling the diode cap and the diode seat to form the laser diode packaging case, and the like. Because a bottom plate is processed by adopting a powder metallurgy injection forming mode, the accuracy and the positioning of a metal boss on the bottom plate can be strictly controlled by adopting the casting insert polishing technology in powder metallurgy, and mass production can be realized without die trimming. The positioning processing accuracy, the verticality and the glossiness of the centre line of the metal boss on the bottom plate from the metal bottom plate are high, and the requirements of the product can be met completely.

Description

technical field [0001] The invention relates to a packaging method of a light-emitting element, in particular to a preparation method of a laser diode packaging shell. Background technique [0002] Laser diodes have developed rapidly in the past two decades, and are widely used in optical storage and optical communications, such as the light source of the read-write head, or the transmission light source of the optical fiber network, as well as other supplies in the fields of national defense, people's livelihood, and experiments. Such as laser list machine, plate making, code reading, micro image generation, quality control and robot vision, etc. When semiconductor laser diodes are used, in order to prevent the external environment from affecting the quality of light emission, it is necessary to package the laser diodes with chips. Conventional laser diode casing packaging tube sockets (such as figure 1 As shown) is composed of a metal base 1', a metal boss 2', a flat lea...

Claims

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Application Information

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IPC IPC(8): H01S5/022
Inventor 唐福云郑水文李若
Owner 湖北讯科光电封装技术有限公司
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