Organic silicon resin-based heat-resisting wave-penetrating composite material and preparation method thereof
A composite material and silicone technology, applied in the field of materials, can solve problems such as insufficient strength, and achieve the effects of excellent bearing capacity, excellent electromagnetic properties, and good high temperature resistance.
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Embodiment 1
[0040] 202g silicone resin solution (GR1320), add 6.1g gas phase method nano-SiO 2 (A380), after adding 45g toluene to reduce the viscosity and stir evenly, ultrasonically disperse for 3 hours, add 6.21g POSS (molecular structure is: n=8, 10, 12, 14) and 0.06g of 2-ethyl 4-methylimidazole and stirred evenly. Immerse 254g of quartz glass cloth (type B quartz cloth, thickness 0.2mm) with the above glue, and after the solvent is completely evaporated, the molding and post-treatment conditions are the same as those of the comparative example. The bending strength of the obtained composite material: 127MPa; the compressive strength: 101.2MPa. In the range of 0.6-8GHz, the average dielectric constant at room temperature is 3.62, and the average dielectric loss is 0.0027; the average dielectric constant at 500°C is 3.45, and the average dielectric loss is 0.0053. After the flat material sample is heated on one side at 700 °C for 1 min, the wave transmittance of 8-12 GHz before and...
Embodiment 2
[0042] 202g organosilicon resin solution (GR1320), add 10.9g gas-phase method nano-SiO 2 (A200), after adding 38g toluene to reduce the viscosity and stir evenly, ultrasonically disperse for 3 hours, add 3.1gPOSS (molecular structure is: ( 10, 12, 14) and 13.8POSS (molecular structure is:
[0043] n=8, 10, 12), 0.62g of diaminodiphenylmethane and stirred evenly. Impregnate 282g of quartz glass cloth (Type B quartz cloth, thickness 0.26mm) with the above glue. After the solvent is completely volatilized, the molding and post-treatment conditions are the same as those in the comparative example. The bending strength of the obtained composite material is 120MPa; the compressive strength is 96.2MPa. At 0.6-8GHz, the average dielectric constant at room temperature is 3.32, and the average dielectric loss is 0.0037; the average dielectric constant at 450°C is 3.42, and the average dielectric loss is 0.0041.
Embodiment 3
[0045]198g silicone resin solution (DC808), add 12.1g nano CaCO 3 (NPCCA-201), add 50g of toluene to reduce the viscosity and stir evenly, ultrasonically disperse for 3 hours, add 7g of POSS (molecular structure: n=8,10,12,14) and 3.8gPOSS (molecular structure is: n=8, 10, 12, 14), add 0.13g of 2-ethyl 4-methylimidazole, and stir evenly. Immerse 165g of glass cloth (D glass fiber cloth, thickness 0.23mm) with the above-mentioned glue solution. After the solvent is completely evaporated, the molding conditions are the same as those of the comparative example, and treated at 400°C for 10 minutes. Measure the flexural strength of the composite material: 140MPa; compressive strength: 98.2MPa. At 0.6-8GHz, the average dielectric constant at room temperature is 3.52, and the average dielectric loss is 0.0057; the average dielectric constant at 500°C is 3.35, and the average dielectric loss is 0.0061.
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Abstract
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