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Organic silicon resin-based heat-resisting wave-penetrating composite material and preparation method thereof

A composite material and silicone technology, applied in the field of materials, can solve problems such as insufficient strength, and achieve the effects of excellent bearing capacity, excellent electromagnetic properties, and good high temperature resistance.

Active Publication Date: 2012-12-05
NO 53 RES INST OF CHINA NORTH IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The high-thickness cloth-reinforced silicone resin composite material has good electromagnetic properties, the dielectric constant at room temperature is 3, and the dielectric loss is 0.01, but the strength is still insufficient, and its bending strength is only 60-80MPa

Method used

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  • Organic silicon resin-based heat-resisting wave-penetrating composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] 202g silicone resin solution (GR1320), add 6.1g gas phase method nano-SiO 2 (A380), after adding 45g toluene to reduce the viscosity and stir evenly, ultrasonically disperse for 3 hours, add 6.21g POSS (molecular structure is: n=8, 10, 12, 14) and 0.06g of 2-ethyl 4-methylimidazole and stirred evenly. Immerse 254g of quartz glass cloth (type B quartz cloth, thickness 0.2mm) with the above glue, and after the solvent is completely evaporated, the molding and post-treatment conditions are the same as those of the comparative example. The bending strength of the obtained composite material: 127MPa; the compressive strength: 101.2MPa. In the range of 0.6-8GHz, the average dielectric constant at room temperature is 3.62, and the average dielectric loss is 0.0027; the average dielectric constant at 500°C is 3.45, and the average dielectric loss is 0.0053. After the flat material sample is heated on one side at 700 °C for 1 min, the wave transmittance of 8-12 GHz before and...

Embodiment 2

[0042] 202g organosilicon resin solution (GR1320), add 10.9g gas-phase method nano-SiO 2 (A200), after adding 38g toluene to reduce the viscosity and stir evenly, ultrasonically disperse for 3 hours, add 3.1gPOSS (molecular structure is: ( 10, 12, 14) and 13.8POSS (molecular structure is:

[0043] n=8, 10, 12), 0.62g of diaminodiphenylmethane and stirred evenly. Impregnate 282g of quartz glass cloth (Type B quartz cloth, thickness 0.26mm) with the above glue. After the solvent is completely volatilized, the molding and post-treatment conditions are the same as those in the comparative example. The bending strength of the obtained composite material is 120MPa; the compressive strength is 96.2MPa. At 0.6-8GHz, the average dielectric constant at room temperature is 3.32, and the average dielectric loss is 0.0037; the average dielectric constant at 450°C is 3.42, and the average dielectric loss is 0.0041.

Embodiment 3

[0045]198g silicone resin solution (DC808), add 12.1g nano CaCO 3 (NPCCA-201), add 50g of toluene to reduce the viscosity and stir evenly, ultrasonically disperse for 3 hours, add 7g of POSS (molecular structure: n=8,10,12,14) and 3.8gPOSS (molecular structure is: n=8, 10, 12, 14), add 0.13g of 2-ethyl 4-methylimidazole, and stir evenly. Immerse 165g of glass cloth (D glass fiber cloth, thickness 0.23mm) with the above-mentioned glue solution. After the solvent is completely evaporated, the molding conditions are the same as those of the comparative example, and treated at 400°C for 10 minutes. Measure the flexural strength of the composite material: 140MPa; compressive strength: 98.2MPa. At 0.6-8GHz, the average dielectric constant at room temperature is 3.52, and the average dielectric loss is 0.0057; the average dielectric constant at 500°C is 3.35, and the average dielectric loss is 0.0061.

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Abstract

The invention belongs to the design and processing technology of composite materials, and relates to an organic silicon resin-based heat-resisting wave-penetrating composite material with electromagnetic function and a preparation process. The heat-resisting wave-penetrating composite material of the invention comprises an organic silicon resin, a fiber-reinforced material, polyhedral oligonmericsilsesquioxane (POSS) with saturated clathrate structure, a nano-inorganic filler and an auxiliary agent and is prepared by impregnation, thermocompression and post-treatment. The composite material has the advantages of high bearing capacity, electromagnetic performance and high-temperature resistance, simple preparation process, and low cost, and is particularly suitable for high-speed flight objects which have the technical requirements on high wave transmission rate, heat-resisting property and strength.

Description

1. Technical field [0001] The invention belongs to the field of material technology, and relates to composite material design and processing technology, in particular to functional composite material and design and preparation technology. 2. Background technology [0002] The radome is an important part of the radar system. It plays an important role in improving the working environment of the radar, especially the radar antenna, and improving the reliability of the work. The aircraft radome is generally located on the head of the aircraft, and has multiple functions such as diversion, heat protection, wave penetration, and load bearing. Radome material technology is one of the essential key technologies for the development of high-speed precision navigation space weapons. Especially in modern times, the development of weapons, projectiles and arrows has put forward higher requirements for wave-transparent materials. Due to the continuous improvement of its flight Mach numbe...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08K5/549C08K3/36C08K7/00C08K3/26C08K3/40C08K3/34
Inventor 李莹王建国魏化震安振河谢可勇
Owner NO 53 RES INST OF CHINA NORTH IND GRP