Vacuum holding nozzle

A vacuum adsorption and adsorption surface technology, applied in the direction of manipulators, electrical components, chucks, etc., can solve the problems of adsorption deviation, inability to adapt to high-speed installation, vibration and sliding of electronic parts, etc., and achieve reliable adsorption effect

Inactive Publication Date: 2010-12-08
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when adsorbed by high-speed flowing gas, the adsorption deviation is likely to occur due to the vibration and sliding of electronic parts, and there is a problem that it cannot adapt to the high-speed installation.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach example

[0068] figure 1 It is a figure which shows an example of the structure when the vacuum suction nozzle which concerns on 1st Embodiment of this invention is assembled|attached to the holding member of an electronic component mounting machine, (a) is a perspective view, (b) is a longitudinal sectional view of (a).

[0069] Such as figure 1 As shown, the vacuum suction nozzle 1 of the first embodiment of the present invention has: the end surface side of the front end has a cylindrical portion 5 for suctioning and holding the suction surface 2 of the electronic component by vacuum suction, and the suction surface of the cylindrical portion 5 is connected to the suction surface. 2, a conical portion 4 that is tapered toward the cylindrical portion 5 on one side opposite to the cylindrical portion 5, and a head 6 that is provided on the end face side of the root portion opposite to the adsorption surface 2. And the suction hole 3 is formed along the inner hole which penetrates t...

no. 2 approach

[0108] Next, an example of the second embodiment of the present invention will be described.

[0109] figure 1 It is a figure which shows an example of the structure when the vacuum suction nozzle of this invention is assembled|attached to the holding member of an electronic component mounting machine, wherein (a) is a perspective view, and (b) is a longitudinal sectional view of (a).

[0110] Such as figure 1 The shown vacuum suction nozzle 1 has: the end surface side of the front end has a cylindrical portion 5 for suctioning and holding an electronic component (not shown) by vacuum suction, and a cylindrical portion 5 on the suction surface with the cylindrical portion 5. 2, a conical portion 4 provided in a tapered shape toward the cylindrical portion 5 on the opposite side, and a head 6 provided on the end face side of the root portion opposite to the adsorption surface 2. In addition, the inner hole penetrating the cylindrical part 5 and opening on the suction surfac...

Embodiment 1

[0172] Next, examples of the present invention will be described.

[0173] Using stabilized zirconia containing 3 mol % of yttrium oxide as the main component and alumina as the second component, Sample Nos. 1 to 11 were produced. First, zirconia and alumina are put into different ball mills together with a solvent, and pulverized to a predetermined particle size to prepare a slurry. The slurry is mixed and spray-dried using a spray dryer to produce granules. The mixing ratio of zirconia and alumina was set to 90% by mass of zirconia and 10% by mass of alumina.

[0174] Next, the pellets, ethylene-vinyl acetate copolymer, polystyrene, and acrylic resin, which are thermoplastic resins, were put into a kneader. A total of 20% by mass of ethylene-vinyl acetate copolymer, polystyrene, and acrylic resin was added to 100% by mass of the pellets. Kneading was performed while maintaining the temperature of 150 degreeC, and the clay was produced. Then, the obtained kneaded clay was...

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PUM

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Abstract

A vacuum holding nozzle is provided which is usable for attaining higher-speed higher-density mounting. The vacuum holding nozzle (1) includes a vacuum holding surface (2) on which a substance to be held is held with suction, and has a suction hole (3) which communicates with the vacuum holding surface (2). The nozzle is characterized in that a tip part thereof including the vacuum holding surface (2) is made of a ceramic, that the ceramic comprises a main ingredient, which constitutes the ceramic, and a second ingredient having an average crystal-grain diameter larger than the average crystal-grain diameter of the main ingredient, and that in the vacuum holding surface (2), crystal grains of the second ingredient are more protrudent than the crystal grains of the main ingredient.

Description

technical field [0001] The present invention relates to a vacuum suction nozzle suitable for use in an electronic component mounting machine for mounting chip-shaped electronic components such as chip capacitors and chip resistors on circuit boards. Background technique [0002] In the past, chip electronic components such as chip capacitors and chip resistors were sucked by vacuum suction to the suction surface at the front end of the vacuum suction nozzle equipped on the electronic component mounting machine, and then transported as they were and mounted on the circuit board. Location. At this time, the position measurement of the sheet-shaped electronic parts is carried out by irradiating light, using a CCD camera to detect the reflected light reflected by the sheet-shaped electronic parts, and using an image analysis device to measure the position of the chip-shaped electronic parts. The shape and electrode position were analyzed. [0003] Figure 10 It is a schematic ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04B25J15/06
CPCH05K13/0408H05K13/0409
Inventor 浜岛浩
Owner KYOCERA CORP
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