Method for preparing suspension micro-sensitive structure based on aluminum sacrificial layer process

Abstract

The invention discloses a method for preparing a suspension micro-sensitive structure based on an aluminum sacrificial layer process. The method comprises the following steps of: introducing a sacrificial layer into a three-layer suspension micro-sensitive structure to restrict a micro-sensitive suspension mass block during the processing, and connecting the suspension micro-sensitive structure and bulk silicon by using an aluminum light film so as to avoid influence of subsequent processing on the suspension structure; removing the sacrificial layer by wet etching; and finally replacing an etching solvent with clean water and ethanol, and drying. The method effectively ensures the integrity and mobility of the suspension micro-sensitive structure without changing the conventional process flow, does not reduce the performance of a micro-mechanical sensor because the mechanical restriction is not increased, reduces the process difficulty, improves the yield and can be widely used for processing various silicon micro-components with the suspension micro-sensitive structure.

Description

technical field [0001] The invention relates to the field of preparation technology for micro-silicon device processing, in particular to a method for preparing a suspended micro-sensitive structure based on an aluminum sacrificial layer technology. Background technique [0002] Micro-silicon electromechanical processing technology is the mainstream technology of micro-electro-mechanical systems MEMS developed with integrated circuit technology in recent years. Micro-silicon devices are manufactured using micro-electromechanical system microelectronics and micro-machining technology. It has small size, light weight, low cost, low power consumption, high reliability, suitable for mass production, easy integration and realizable Intelligent features. At the same time, the feature size on the order of microns enables it to perform functions that some traditional mechanical sensors cannot achieve, so microelectronics and micromachining technology of microelectromechanical syste...

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Problems solved by technology

However, increasing the mechanical constraints will inevitably lead to a decrease in the performance of the micromechanical sensor. At the same time, due to the small internal space and relatively closed structure of the glass-silicon-glass sandwich structure, the current sacrificial layer technology for this structure is not mature. Now some Technology has tried to introduce a silicon dioxide sacrificial layer, but due to the certain damage to the bulk silicon when removing the sacrificial layer, the processing difficulty of micro-silicon devices has been greatly increased, resulting in micro-mechanical sensors generally facing difficulties in processing, high processing costs, Problems such as low yield

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