Method for cleaning surface of magnesium aluminum alloy subjected to chemically mechanical polishing

Abstract

The invention discloses a method for cleaning the surface of a magnesium aluminum alloy subjected to chemically mechanical polishing, aiming at providing a simple and easy cleaning method capable of reducing the subsequent processing cost of the alkali chemically mechanical polishing of the magnesium aluminum alloy and improving the surface quality of a wafer. The method comprises the steps of: taking ultrapure water with resistance of above 18M omega, stirring and adding a non-ionic surface active agent and an FA/O chelating agent at the same time; adopting an ultrapure water diluting rust inhibitor with resistance of above 18M omega; adding the diluted rust inhibitor into the liquid under the stirring, uniformly stirring to obtain a soluble surface cleaning liquid, rapidly carrying out polishing cleaning on the magnesium aluminum alloy subjected to the chemically mechanical polishing by using the obtained soluble surface cleaning liquid under the condition of large flow and low pressure; and washing by using the ultrapure water with resistance of above 18 M omega under the condition of zero-pressure and large-flow.

Description

technical field [0001] The invention relates to a method for cleaning the surface of a magnesium-aluminum alloy after chemical mechanical polishing. Background technique [0002] Magnesium-aluminum alloys are strategically important metals. Magnesium-aluminum alloys are widely used in aerospace products, such as aircraft landing wheels, gearbox covers, and helicopter horizontal rotor accessories. With the continuous improvement of magnesium-aluminum alloy smelting and manufacturing technology, aluminum-magnesium alloys are also widely used in tank armor parts, missile shells and empennages in the defense industry. Especially in some planar devices, such as flyers, samples and other key or important components, it is necessary to achieve ultra-precise planarization processing with extremely high precision and nearly no defects. These requirements have reached the limit of the current single mechanical cutting or grinding and polishing processing capabilities, and have incre...

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Problems solved by technology

At present, the surface of magnesium-aluminum alloy is cleaned by washing with water. Due to the high temperature, high energy and high surface tension of the wafer surface, although the polishing has stopped, the reaction on the wafer surface has a lagging process, and it will be easy in the air. Oxidation, simple water washing can not avoid the phenomenon of uneven distribution of polishing liquid, contamination of metal ions, etc., resulting in uneven fog, high roughness, uneven corrosion, etc. on the surface of the wafer after cleaning. On the 8-inch chip, the grain There are more than 1,000 particles with a diameter greater than 0.1 micron, which seriously affects the surface quality of the wafer, resulting in an increase in the cost of subsequent processing and a decrease in the precision of the device

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