Industrial afterheat semiconductor power generation method and device using heat carrier as heating medium

Abstract

The invention discloses an industrial afterheat semiconductor power generation method and an industrial afterheat semiconductor power generation device using heat carrier as heating medium, which use heat-conducting oil as a working medium for recovering and using afterheat. The device comprises a boiler flue, in-flue equipment, out-flue equipment and connecting pipes for connecting the boiler flue and the in-flue equipment and out-flue equipment, wherein at least one heat-conducting oil heater and at least one phase change heat exchange are arranged in the flue in turn; the phase change heat exchange comprises an evaporator and a condenser; the condenser cools steam by using an indirect heat exchange mode and by using heat-conducting oil as a cooling medium; the heat-conducing oil is heated and delivered to the heat-conducting oil heater for recovering the afterheat of flue gases continuously, the heat-conducting oil heated by the heat-conducting oil heater enters a semiconductor temperature-difference power generation device for generating power, the heat-conducting oil flowing out is used for heating feedwater and air, the feedwater and hot air are supplied to a system to be used after heat recovery and enters the condenser of the phase change heat exchanger in a power generation module, the heat at the cold end face of the semiconductor power generation module is recovered, gas is separated out through oil-gas separation and is exhausted from a high expansion groove, and the liquid heat-conducting oil can be recycled.

Description

technical field [0001] The invention relates to an industrial waste heat semiconductor power generation method and device using a heat carrier such as heat conduction oil as a heat medium, belonging to the field of industrial waste heat recovery. Background technique [0002] The flue gas discharged from power station boilers, industrial boilers, industrial furnaces, etc. contains a lot of heat, and waste heat recovery devices such as economizers and air preheaters are usually installed to absorb part of the waste heat of the flue gas, but the exhaust gas temperature is usually at 140 ℃~160℃ or higher, and the exhaust gas temperature of the kiln with smaller capacity is even higher. Due to the presence of sulfide in the flue gas, the outlet temperature of the flue gas on the heating surface at the rear of the air preheater is limited. If the exhaust gas temperature is too low, the wall temperature of the heating surface will be lower than the acid dew point of the flue gas, ...

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Problems solved by technology

However, this technology has certain disadvantages: that is, the cooling source of the semiconductor thermoelectric generator needs to use a large amount of cooling water, and the heat taken away by the cooling water can only be recycled after being dissipated by the cooling tower, and the circulation of the cooling water requires a certain amount of electric energy

However, this technology also has problems: since the heat on the cold end surface of the semiconductor thermoelectric power generation module cannot be recycled and can only be lost to the atmosphere, this technology limits the boiling point of the cooling liquid to less than 100°C; inside the evaporator of the cold end surface of the power generat

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