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Carbon chemical adsorption method for preparing graphene film by using atomic layer deposition

A graphene thin film and atomic layer deposition technology, which is applied in gaseous chemical plating, coating, metal material coating technology, etc., can solve the problems that do not meet the requirements of ALD growth, and achieve simple and easy adsorption methods and stable carbon The effect of chemical adsorption

Active Publication Date: 2012-07-25
INST OF MICROELECTRONICS CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In the current method of preparing graphene, common gases, such as precursors such as methane, need to be pyrolyzed to obtain carbon atoms, and this growth method does not meet the requirements of ALD low temperature (200°C-450°C) growth, so it is necessary to use ALD realizes the growth of graphene film, and the chemical adsorption of carbon atoms and substrate is the key issue

Method used

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  • Carbon chemical adsorption method for preparing graphene film by using atomic layer deposition
  • Carbon chemical adsorption method for preparing graphene film by using atomic layer deposition
  • Carbon chemical adsorption method for preparing graphene film by using atomic layer deposition

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Embodiment 1

[0020] A carbon chemical adsorption method for preparing graphene film by atomic layer deposition, comprising the steps of:

[0021] Step 101, treating the surface of the (0001) crystal plane of the silicon carbide substrate terminated with carbon atoms with hydrogen for 20 minutes to form a C-H bond on the surface of the silicon carbide substrate, such as figure 1 As shown in figure a;

[0022] Step 102, placing the silicon carbide substrate after the hydrogenation treatment in the reaction chamber of the atomic layer deposition equipment, passing argon gas into the reaction chamber of the atomic layer deposition device to clean the reaction chamber; Nitrogen methane gas is irradiated with ultraviolet light at the same time to decompose diazomethane, and the decomposition products have unbonded electrons. The chemical expression of diazomethane decomposition is: Diazomethane can also be decomposed by low-temperature heating, the heating temperature is 200°C-500°C, and the c...

Embodiment 2

[0025] Step 101, treating the surface of the (0001) crystal plane of the silicon carbide substrate terminated with carbon atoms with hydrogen for 20 minutes to form a C-H bond on the surface of the silicon carbide substrate, such as figure 1 As shown in figure a;

[0026] Step 102, placing the silicon carbide substrate after the hydrogenation treatment in the reaction chamber of the atomic layer deposition equipment, passing argon gas into the reaction chamber of the atomic layer deposition device to clean the reaction chamber; and then passing ethylene into the reaction chamber Ketone gas is irradiated with ultraviolet light or heated at low temperature to decompose ketene, and the decomposition products have unbonded electrons. The chemical expression of ketene decomposition is: Such as figure 1 As shown in Figure b;

[0027] The decomposition product carbene (: CH2) undergoes an insertion reaction with the silicon carbide substrate, and the chemical expression of the rea...

Embodiment 3

[0029] Step 101, fixing the (0001) crystal plane silicon carbide substrate terminated with carbon atoms in the reaction chamber of the atomic layer deposition equipment;

[0030] Step 102, passing argon gas into the reaction chamber of the atomic layer deposition equipment for 5 minutes, and exhausting the gas in the reaction chamber;

[0031] Step 103, feed a methyl iodide gas into the reaction chamber of the atomic layer deposition equipment, such as figure 2 As shown in the figure a, and irradiated with sunlight, methyl iodide is decomposed, and the expression of the decomposition is: Such as figure 2 As shown in figure b in the middle; the product of the decomposition of methyl iodide and the surface of the silicon carbide substrate form bonds through carbon atoms to form a methyl structure to achieve stable chemical adsorption, such as figure 2 As shown in Figure c.

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Abstract

The invention relates to preparation technology of graphene, in particular to a carbon chemical adsorption method for preparing a graphene film by using atomic layer deposition. A substance containing carbon atoms which have non-bonded electrons is formed, and the carbon atoms and atoms on the surface of a substrate form covalent bonds so that stable chemical adsorption is realized. The adsorption method for preparing the graphene film by using the atomic layer deposition technology is simple and feasible, and can realize stable carbon chemical adsorption.

Description

technical field [0001] The invention relates to the preparation technology of graphene, in particular to a carbon chemical adsorption method for preparing graphene film by atomic layer deposition. Background technique [0002] Graphene is graphite with a single atomic layer thickness. Since it was successfully peeled off in 2004, it has attracted widespread attention from scientists. Due to its excellent performance in electricity, mechanics, and heat, the performance of the prepared semiconductor device will be better than that of silicon-based devices. Graphene material is a very promising material, which will surely replace silicon in semiconductors, but the first premise is that graphene in the strict sense can be prepared, that is, graphene with a single atomic layer thickness. Atomic layer deposition (Atomic Layer Deposition, hereinafter referred to as ALD), as a new method of preparing thin films, has been widely used now. Its single atomic layer layer-by-layer growt...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C16/26
Inventor 夏洋饶志鹏刘键
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI