Air pressure spot coating soldering paste for connector

A connector and solder paste technology, which is applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of no connector, decline in thermal collapse resistance, and ordinary solder paste cannot meet performance requirements, etc., to achieve The effect of cost saving, smooth use, and excellent welding performance requirements

Active Publication Date: 2011-03-30
厦门市及时雨焊料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Communication is a systematic project, and the performance of each component used will affect the performance of the entire network. The communication connector belongs to the network transmission medium interconnection device, and the performance of the connector used may affect the entire communication system. The connector is due to its process. Particularity The solder paste used should be stored in a syringe. In the process of use, in addition to requiring no tin beads after soldering, good wettability, and good thixotropy, the solder paste is also required to have good fluidity, so that the solder paste can be used during use. It can be used smoothly without clogging the needle. At the same time, the solder paste for connectors also has high requirements for thermal collapse resistance. It requires no deformation at high temperature of the solder paste. However, fluidity and thermal collapse resistance are two contradictory Factors, while improving fluidity, will inevitably reduce the performance of thermal collapse resistance
In the process of producing connectors, due to the particularity of its process, the use of ordinary solder paste cannot meet its performance requirements
[0006] The development of solder paste is becoming more and more mature, and there are many patents issued in the direction of solder paste, but there is no solder paste for the characteristics of connectors so far. Therefore, a new type of solder paste suitable for connectors that can solve the contradiction between the two is developed. of solder paste is necessary

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] First configure the soldering paste A according to the following ratio, and then stir the alloy powder and the soldering paste A in a certain ratio to make them evenly mixed to obtain the finished product, put the prepared product in the syringe, and use the air pressure point Coating method Test the prepared product to observe its flow performance after long-term use; at the same time, take part of the solder paste and print it on the PCB board and place it in a 180-degree oven for about 5 minutes to observe whether the solder paste collapses or deforms.

[0026] 1. Composition of solder paste A

[0027] Polyisobutylene 8%

[0028] Di(benzylidene)sorbitol 0.5%

[0029] Water white rosin 25%

[0030] Polymerized Rosin 25%

[0031] Succinic Acid 7%

[0032] Triethanolamine 7%

[0033] Ethylene glycol 7%

[0034] Triethylene Glycol 15%

[0035] Dehydrated Castor Oil Fatty Acid 2%

[0036] L-Ascorbyl Palmitate 3%

[0037] 2. Composition of solder paste

[0038] S...

Embodiment 2

[0042] First configure soldering paste B according to the following ratio, and then stir the alloy powder and soldering paste B in a certain ratio to make them evenly mixed to obtain a finished product, put the prepared product in a syringe, and use air pressure point Coating method Test the prepared product to observe its flow performance after long-term use; at the same time, take part of the solder paste and print it on the PCB board and place it in a 180-degree oven for about 5 minutes to observe whether the solder paste collapses or deforms.

[0043] 1. Composition of solder paste B

[0044] Polyglycol 12%

[0045] Bis(p-methyl-dibenzylidene sorbitol) 1%

[0046] Hydrogenated Rosin 14%

[0047] Gum Rosin 20%

[0048] Citric Acid 5%

[0049] Monoethanolamine 10%

[0050] Ethylene glycol 20%

[0051] Glycerol 10%

[0052] Ricinoleic Acid 3%

[0053] L-Ascorbyl Palmitate 5%

[0054] 2. Composition of solder paste

[0055] Solder Paste B 14%

[0056] Alloy powder S...

Embodiment 3

[0059] First configure the soldering paste C according to the following ratio, and then stir the alloy powder and the soldering paste C in a certain ratio to make them evenly mixed to obtain the finished product, put the prepared product in the syringe, and use air pressure point Coating method Test the prepared product to observe its flow performance after long-term use; at the same time, take part of the solder paste and print it on the PCB board and place it in a 180-degree oven for about 5 minutes to observe whether the solder paste collapses or deforms.

[0060] 1. Composition and mass percentage of solder paste C

[0061] Silicone oil 10%

[0062] Di(benzylidene)sorbitol 0.1%

[0063] Polymerized Rosin 14.9%

[0064] Disproportionated Rosin 30%

[0065] Oleic Acid 4%

[0066] Monoethanolamine 6%

[0067] Ethylene glycol 20%

[0068] Glycerol 15%

[0069] Lauryl Hydroxystearic Acid 2.5%

[0070] L-Ascorbyl Palmitate 2%

[0071] 2. Composition of solder paste

[...

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PUM

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Abstract

The invention relates to a soldering paste for a connector and an air pressure spot coating mode. In order that the liquidity of the soldering paste is good, the liquidity can be kept for long time during use and a needle tube is not plugged, a lubricating agent is added based on a common soldering paste formula; and in order that the collapse resistance of the soldering paste is not affected at the same time of improving the liquidity of the soldering paste, a nucleation transparent agent is added based on the original soldering paste formula. The soldering paste consists of lead-free alloy powder and flux paste, wherein the flux paste comprises the following components in percentage by mass: lubricating agent, nucleation transparent agent, rosin, active agent, solvent, thixotropic agentand antioxidant.

Description

technical field [0001] The invention relates to a material for electronic packaging, in particular to a no-clean solder paste which can be continuously distributed by air pressure point coating and used for connector welding. Background technique [0002] As an electronic material, solder paste is both an old material and a new one. With the miniaturization, high performance, and multi-purpose development of computers, communication equipment, and household appliances, reflow soldering has become the only way to manufacture these products, so solder paste has emerged as the times require. [0003] Solder paste, that is, solder paste, is a paste made of alloy solder powder and flux system uniformly mixed in a certain proportion, which can form an alloy connection during soldering. In reflow soldering, this substance is used for the connection between the pins or electrode terminals of surface mount components and the pads. [0004] Solder paste has strong plasticity and a w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/363B23K35/26
Inventor 孙洪日罗礼伟
Owner 厦门市及时雨焊料有限公司
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