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Hot melt adhesive

A technology of hot-melt adhesives and hot-melt adhesives, which is applied to hot-melt adhesives. It can solve problems such as poor strength and elasticity, limited use, high melting point and hardness, and achieve high bonding strength, excellent elasticity, and a wide range of applications.

Inactive Publication Date: 2011-03-30
曹年生
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most hot melt adhesives are made of ethylene-vinyl acetate (EVA), polyester, polyamide and other hot melt resins. Due to the poor strength and elasticity of EVA and polyester hot melt adhesives, they cannot withstand too much external force. , and due to the high melting point and hardness of polyamide hot melt adhesive, it is limited in use

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0010] Embodiment 1: a kind of hot-melt adhesive of the present invention, its component is 90 mass parts polybutylene adipate, 250 mass parts polyethylene adipate glycol, 6 mass parts 1,4-butanediol, 20 mass parts Parts by mass of epoxy resin, 8 parts by mass of filler and 0.5 part by mass of polyphenylene ether; the filler is talcum powder.

Embodiment 2

[0011] Embodiment 2: a kind of hot-melt adhesive of the present invention, its component is 100 mass parts polybutylene adipate, 300 mass parts polyethylene adipate glycol, 9 mass parts 1,4-butanediol, 30 Parts by mass of epoxy resin, 10 parts by mass of filler and 1 part by mass of polyphenylene ether; the filler is pottery clay.

Embodiment 3

[0012] Embodiment 3: a kind of hot-melt adhesive of the present invention, its component is 95 mass parts polybutylene adipate glycol, 270 mass parts polyethylene adipate glycol, 8 mass parts 1,4-butanediol, 25 mass parts Parts by mass of epoxy resin, 9 parts by mass of filler and 0.8 part by mass of polyphenylene ether; the filler is mica powder.

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PUM

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Abstract

The invention relates to a hot melt adhesive which comprises the components in mass: 90-100 parts of polybutylene adipate, 250-300 parts of polydiethylene glycol adipate, 6-9 parts of 1,4-butanediol, 20-30 parts of epoxy resin, 8-10 parts of filling material and 0.5-1 part of polyphenyl ether. The hot melt adhesive can loose hydrogen bonding action after being heated to become a molten sticky liquid, and can restore original physical properties after being cooled. The hot melt adhesive has the advantages of excellent elasticity, high bonding strength, solvent resistance, wear resistance and wide usable range, can be used for bonding various materials and is especially applicable to bonding fabrics.

Description

technical field [0001] The invention relates to an adhesive, specifically a hot melt adhesive. Background technique [0002] Hot-melt adhesive is a solvent-free solid adhesive with thermoplastic resin as the main component. Because hot melt adhesive has the advantages of fast bonding speed, non-toxicity, simple bonding process and good bonding strength and flexibility, it can bond various materials such as wood, paper, fiber, metal, plastic, etc. It is widely used, especially in the fiber industry, packaging industry and bookbinding industry. However, most hot melt adhesives are made of ethylene-vinyl acetate (EVA), polyester, polyamide and other hot melt resins. Due to the poor strength and elasticity of EVA and polyester hot melt adhesives, they cannot withstand too much external force. , and due to the high melting point and hardness of polyamide hot melt adhesive, it is limited in use. Contents of the invention [0003] Purpose of the invention: The purpose of the i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J167/02C09J163/00C09J171/02
Inventor 曹年生
Owner 曹年生
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