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Coating method for coating material

A coating method and technology of coating materials, which are applied in coatings, devices for coating liquid on surfaces, and coating equipment for photographic plate-making processes, etc., can solve problems such as exposure machine pollution, achieve pollution and improve yield Effect

Inactive Publication Date: 2011-04-20
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP +1
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  • Abstract
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  • Claims
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Problems solved by technology

[0011] The invention provides a coating method, which can form a coating with better thickness uniformity, solves the problem that the thicker coating in the edge area of ​​the semiconductor wafer causes pollution to the exposure machine, and improves the quality of the product. Rate

Method used

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Embodiment Construction

[0026] As mentioned in the background art, in the coating process of coating materials such as photoresist and polyimide, due to the influence of centrifugal force generated by rotation, the surface of the formed coating is concave, that is, The edge area of ​​the semiconductor wafer gathers more photoresist, while the central area is less, so that the coating thickness of the edge area of ​​the semiconductor wafer is larger than that of the central area, which not only causes the coating material to The contamination caused by side flow to the back will also cause the semiconductor wafer to pollute the loading stage of the exposure machine, and the thicker coating material in the edge area of ​​the surface of the semiconductor wafer will also affect the line width of the exposure process and reduce the yield of the product. rate, bringing huge losses to process production.

[0027] The core idea of ​​the present invention is to provide a method for coating a coating material,...

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Abstract

The invention discloses a coating method for a coating material. The method comprises the following steps of: providing a semiconductor wafer; spraying the coating material on the surface of the semiconductor wafer; rotating the semiconductor wafer to form a coating on the surface of the semiconductor wafer, wherein the coating in the edge region of the semiconductor wafer is thicker than the coating in the center region; continuously rotating the semiconductor wafer and spraying cleaning solution in the partial edge region of the semiconductor wafer simultaneously; and rotating the semiconductor wafer again. By the coating method, a coating with uniform thickness can be formed, the problem that the thicker coating material on the edge of the semiconductor wafer pollutes an exposure machine table is solved, and the yield of products is improved.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to a method for coating coating materials. Background technique [0002] In the semiconductor manufacturing process, integrated circuits with various functions are formed on the semiconductor wafer through a series of processes such as photolithography, etching, doping, film deposition, planarization, and cleaning. The photolithographic process of the area plays a very important role. [0003] In the photolithography process, first, a photoresist layer is formed on the semiconductor wafer by a spin coating device; then, the photoresist layer is placed in an exposure device after being baked, and the photoresist layer is exposed to the photoresist by the exposure process. layer is exposed to transfer the pattern on the mask to the photoresist layer; then, the exposed photoresist layer is post-exposure baked and developed by a developing process to form a photoresist l...

Claims

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Application Information

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IPC IPC(8): B05D5/00B05D7/00B05D7/24B05C11/02B05C11/08G03F7/16
Inventor 章国伟张尔飚吴欣华刘贵娟
Owner SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORP
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