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Planar connector

一种连接器、平面状的技术，应用在连接、两部件连接装置、耦合装置等方向，能够解决填充压力变高、未得到性能平衡性、流动性不充分等问题

Active Publication Date: 2011-04-27
POLYPLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, for use as a very thin-walled planar connector in which the pitch space of the lattice portion required in recent years is 2 mm or less, and the width of the resin portion of the lattice portion holding the terminal is 0.5 mm or less. , even a glass fiber reinforced liquid crystalline polymer composition with good fluidity to a certain extent, its performance is still insufficient
That is, in such a planar connector in which the width of the grid portion is very thin, if the resin is to be filled into the grid portion, the filling pressure will be increased due to insufficient fluidity, and as a result, there will be a resulting flat connector. The problem that the amount of warping deformation of the connector increases
[0005] In order to solve this problem, it is conceivable to use a liquid crystal polymer composition with good fluidity in which the amount of glass fiber added is reduced, but such a composition has insufficient strength, and there is a problem of deformation due to reflow soldering (reflow) during mounting.
[0006] In this way, the current situation is that a planar connector made of a liquid crystal polymer with excellent performance balance has not yet been obtained.

Method used

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Examples

Experimental program
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Effect test

Embodiment

[0064] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited thereto. In addition, measurements and tests of physical properties in Examples were carried out by the following methods.

[0065] (1) Apparent melt viscosity

[0066] The apparent melt viscosity was measured according to ISO11443 at a temperature of 360° C. and a shear rate of 1000 / s using a capillary rheometer with L=20 mm and d=1 mm (CAPILOGRAPH 1B manufactured by Toyo Seiki Co., Ltd.). The measurement was performed at 380°C when liquid crystal polymer 1 and liquid crystal polymer 2 were used, at 350°C when liquid crystal polymer 3 was used, and at 360°C when liquid crystal polymer 4 was used.

[0067] (2) Determination of connector flatness

[0068] Injection molding from resin composition pellets under the following molding conditions such as figure 1 The planar connector shown below (the number of pin holes is 1248pin): the overall siz...

Embodiment 7

[0090] Mold temperature: 80°C

[0091] Injection speed: 300mm / sec

[0092] Holding pressure: 50MPa

[0093] Filling time: 0.09~0.11sec

[0094] Holding time: 1sec

[0095] Cooling time: 10sec

[0096] Screw speed: 120rpm

[0097] Screw back pressure: 1MPa

[0098] (3) Melting point of liquid crystal polymer

[0099] Using a differential thermal analysis device (TA Instruments Q-1000), the polymerized polymer was heated from room temperature to 400°C at a temperature increase of 20°C / min and kept for 3 minutes, and then cooled at 20°C / min It was cooled to room temperature under the condition, and then measured again under the condition of heating up at 20°C / min.

[0100] (4) Minimum filling pressure

[0101] injection molding figure 1 The minimum injection filling pressure that can get a good molded product is the minimum filling pressure when the planar connector is used.

[0102] (5) Grid strength

[0103] use figure 1 of planar connectors, determined Figure 4 T...

Embodiment 1～7 and comparative example 1～8

[0126] The above-mentioned test pieces of the liquid crystalline polymer composition containing platy fillers and fibrous fillers were prepared and evaluated under the following conditions, and the results shown in Table 1 were obtained. In addition, in Comparative Example 8, a good test piece could not be obtained by injection molding.

[0127] [manufacturing conditions]

[0128] (use ingredients)

[0129] (A) liquid crystal polymer

[0130] · Liquid crystal polymer 1

[0131] Into a polymerization vessel equipped with a stirrer, a reflux column, a monomer input port, a nitrogen gas introduction port, and a decompression / outflow line, the following raw material monomers, a metal catalyst, and an acylating agent were charged.

[0132] · (I) 1218g (48mol%) 6-hydroxy-2-naphthoic acid (HNA)

[0133] · (II) 560 g (25 mol%) terephthalic acid (TA)

[0134] (III) 628g (25 mol%) 4,4'-dihydroxybiphenyl (BP)

[0135] (IV) 37g (2 mole %) 4-hydroxybenzoic acid (HBA)

[0136] · Pota...

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Abstract

Disclosed is a planar connector that can cope with even a change in shape of recent planar connectors and is excellent, for example, in all of flatness, warpage deformation, and heat resistance properties. Specifically, the planar connector is characterized in that the planar connector is formed of a composite resin composition comprising (A) a liquid crystalline polymer having a p-hydroxy benzoic acid residue content of not more than 55% by mole and having a melting point of 330 DEG C or above, (B) a plate-like inorganic filler, and (C) a fibrous filler having a weight average fiber length of 250 to 600 [mu]m, the content of the component (B), the content of the component (C), and the total content of the components (B) and (C) being 25 to 35% by weight, 10 to 25% by weight, and 40 to 50% by weight, respectively, based on the whole composition, and the planar connector has such a structure that the inside of an outer frame has a lattice structure, the inside of the lattice structure has an opening part, the pitch interval of the lattice part is not more than 1.5 mm, and the ratio between the thickness of the outer frame part and the thickness of the lattice part is not more than 0.8.

Description

technical field [0001] The present invention relates to a planar connector having a lattice structure inside an outer frame such as a CPU socket. Background technique [0002] Liquid crystalline polymers are known as materials that have excellent dimensional accuracy, vibration damping properties, and fluidity among thermoplastic resins, and which rarely generate burrs during molding. Conventionally, taking advantage of such characteristics, liquid crystalline polymers have been widely used as materials for various electronic components. [0003] In particular, with the high performance of electronic equipment in recent years, there are demands of the times such as high heat resistance of connectors (improved productivity by mounting technology), high density (multi-core), and miniaturization. The characteristics of the above-mentioned liquid crystal polymers, the use of glass fiber-reinforced liquid crystal polymer compositions as connectors ["Comprehensive Survey of Engin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01R24/00C08K3/34C08K7/00C08L67/02
CPCC08K7/28C08K3/34
Inventor 深津博树西川雷太大芝浩一粥川圣士渡边一史
Owner POLYPLASTICS CO LTD
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