Resin composition for forming the adhesive layers of a multi-layer flexible printed circuit board
A technology of resin composition and printed circuit board, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of non-rigid mechanical strength, etc., and achieve the effect of suppressing defects and reducing thickness
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0087] When describing an Example, the synthesis example of two types of phosphorus-containing epoxy resins used in an Example is demonstrated.
[0088] The synthetic example of phosphorus-containing epoxy resin A: in the four-necked glass separable flask that is equipped with stirrer, thermometer, condensing tube, nitrogen introduction device, the 10-(2 of 5-dihydroxybenzene of packing into 324 parts by weight Base)-10H-9-oxa-10-phosphaphenanthrene-10-oxide (manufactured by HCA-HQ Sanko Co., Ltd.) and 300 parts by weight of ethyl cellosolve were heated and dissolved. 680 parts by weight of YDF-170 (bisphenol F-type epoxy resin, manufactured by Toto Chemical Co., Ltd.) was added, stirred while introducing nitrogen gas, and heated to 120° C. for mixing. 0.3 parts by weight of a triphenylphosphine reagent was added, and reacted at 160° C. for 4 hours. The epoxy equivalent of the obtained epoxy resin was 501 g / eq, and the phosphorus content rate was 3.1 weight%.
[0089] The sy...
Embodiment 2
[0106] In this embodiment 2, the resin composition described in the above table 1 is adopted, and the resin composition is prepared according to the compounding ratio recorded in table 3, to replace the resin composition of embodiment 1, and then dimethylacetamide is used as solvent, the following resin varnishes were formulated. Others are the same as in Example 1.
[0107] table 3
[0108]
[0109] Next, a resin-coated copper foil was manufactured in the same manner as in Example 1, and the evaluation of the multilayer printed wiring board and the evaluation of the flexibility after the resin layer was cured were performed in the same manner as in Example 1. These evaluation results are shown in Table 5 below to enable comparison with Comparative Examples.
Embodiment 3
[0111] In this embodiment 3, the resin composition described in the above table 1 is adopted, and the resin composition is prepared according to the compounding ratio recorded in table 4, to replace the resin composition of embodiment 1, and then dimethylacetamide is used as solvent, the following resin varnishes were formulated. Others are the same as in Example 1.
[0112] Table 4
[0113]
[0114] Next, a resin-coated copper foil was manufactured in the same manner as in Example 1, and the evaluation of the multilayer printed wiring board and the evaluation of the flexibility after the resin layer was cured were performed in the same manner as in Example 1. These evaluation results are shown in Table 7 below to enable comparison with Comparative Examples.
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| peel strength | aaaaa | aaaaa |
| epoxy equivalent | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More