BGA (ball grid array) solder ball surface finish processing method and device

Abstract

The invention relates to a BGA (ball grid array) solder ball surface finish processing method and device. The method comprises the following steps: packaging BGA solder balls into an operating roller, and maintaining the solder balls to be loose; rotating the operating roller to carry out autogenous grinding and polishing on the solder balls in the operating roller; and after the grinding is finished, stopping rotating the operating roller and taking out the solder balls, wherein the operating roller is a cylinder rotating around a shaft axis or one or more cylinders revolving around the sameshaft axis. The device is a BGA solder ball autogenous grinding machine, comprising a machine base, the operating roller, a motor and a reduction box, wherein the wall of the operating roller is provided with a loading and discharging switch, the two ends of the operating cylinder are provided with solid shafts, the solid shafts rotate on a bearing mechanism, the solid shafts and the reduction box are connected in a transmission way by virtue of a rigid coupling, the operating roller is internally provided with a ball shaking cup, and the cup is filled with the solder balls, and the motor is a frequency variable motor. The device in the invention has a compact structure and is convenient to maintain and use, and the solder ball surface finish problem can be solved while the original welding performance of the solder balls can be guaranteed.

Description

technical field [0001] The invention relates to a solder used for chip packaging in the microelectronics industry, a method and equipment for treating the surface smoothness of BGA solder balls. Background technique [0002] With the development of terminal consumer electronics products in the direction of "light, thin, short, small" and multi-functionality, integrated circuit packaging technology is forced to evolve in the direction of high density, miniaturization and integration. With the continuous improvement of integrated circuit integration, the form of electronic packaging has gradually evolved from quadrilateral pin (QFP) to ball grid array (BGA) packaging. In BGA and CSP packaging processes, precision solder balls are used to replace pins to realize circuit Electrical and mechanical connections between the substrate and the chip. Precision solder balls are small balls of solder alloy with a diameter ranging from 50um to 760um. The automatic production of electron...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is exactly at the problem of above-mentioned prior art, proposes a kind of BGA solder ball surface finish treatment method and equipment, makes it effectively solve BGA solder ball manufacturing process, the surface quality problems such as tin ball surface haze, wrinkle, To overcome the deficiencies of the existing technology

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