Modified phenolic aldehyde foam plate and composite plate thereof as well as method for manufacturing modified phenolic aldehyde foam plate and composite plate

A phenolic foam board and phenolic foam technology, which are applied in chemical instruments and methods, building structures, lamination devices, etc., can solve the problems of poor compressive strength, easy pulverization, easy dusting, etc. Dust and not easy to peel off

Inactive Publication Date: 2011-06-15
厦门高特高新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to overcome the shortcomings of poor toughness, easy pulverization, easy dusting, and poor compressive strength that phenolic foam materials in the prior art generally have, and provide a modified phenolic foam board and its manufacturing method. overcome these deficiencies

Method used

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  • Modified phenolic aldehyde foam plate and composite plate thereof as well as method for manufacturing modified phenolic aldehyde foam plate and composite plate
  • Modified phenolic aldehyde foam plate and composite plate thereof as well as method for manufacturing modified phenolic aldehyde foam plate and composite plate
  • Modified phenolic aldehyde foam plate and composite plate thereof as well as method for manufacturing modified phenolic aldehyde foam plate and composite plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment one modified phenolic foam board

[0020] A kind of modified phenolic foam board of the present invention, with reference to figure 1 , including a layer of phenolic foam layer 10, the upper and lower surfaces of the phenolic foam layer 10 are respectively filled with a layer of three-dimensional fluffy material layer 20, the phenolic foam layer 10 is filled into the gaps of the three-dimensional fluffy material layer 20, and the three-dimensional fluffy material layer 20 form a one-piece structure, so that the modified phenolic foam board of the present invention has the advantages of good toughness, high strength, not easy to generate dust, and not easy to pulverize.

[0021] In the present invention, the thickness of the phenolic foam layer 10 is preferably 20-100 mm, and the thickness of the three-dimensional fluffy material layer 20 is preferably 2-50 mm. The three-dimensional fluffy material layer 20 is glass fiber, chemical fiber, and sprayed cotton, ...

Embodiment 2

[0023] The manufacture method of embodiment two modified phenolic foam boards

[0024] The manufacturing method of a kind of modified phenolic foam board of the present invention comprises the following steps: put the three-dimensional fluffy material on the auxiliary surface layer material through the pressure roller, and send it into the upper and lower parts of the continuous phenolic foam board production device or the shaping mold cavity On the lower surface, the expandable phenolic resin composition is poured on the three-dimensional fluffy material stacked with the auxiliary surface layer material, heated, foamed and shaped, then matured and demoulded, and the auxiliary surface layer material is removed to obtain a modified phenolic foam board .

[0025] In the present invention, the expandable phenolic resin composite material is preferably composed of components in the following weight ratio: phenolic resin: surfactant: foaming agent: curing agent=100: (1~5): (1~10) ...

Embodiment 3

[0026] Example three Modified phenolic foam composite board

[0027] refer to figure 2 , a kind of modified phenolic foam composite board of the present invention, comprises one deck phenolic foam layer 10, is filled with one deck three-dimensional fluffy material layer 20 respectively on the upper and lower surface of this phenolic foam layer 10, in upper and lower three-dimensional fluffy material layer The surface of 20 is respectively compounded with one deck composite surface layer 30 with glue.

[0028] In the present invention, the composite surface layer 30 is aluminum foil, aluminum foil paper, kraft paper, color steel plate, galvanized steel plate, tinplate plate, stainless steel plate, glass magnesium plate, calcium silicate plate or cement pressure plate, and its thickness is preferably 0.05-5 mm. The glue used for compounding is preferably one or a combination of polyurethane glue, phenolic resin glue, styrene-butadiene latex, and acrylic glue.

[0029] The com...

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Abstract

The invention relates to a phenolic aldehyde foam plate, in particular to a modified phenolic aldehyde foam plate and a composite plate thereof, and a method for manufacturing the modified phenolic aldehyde foam plate and the composite plate thereof. The phenolic aldehyde foam plate comprises a phenolic aldehyde foam layer, wherein at least one three-dimensional fluffy material layer is filled in the upper surface, the lower surface and the interlayer of the phenolic aldehyde foam layer. Compared with the prior art, in the modified phenolic aldehyde foam plate manufactured according to the invention, an expandable phenolic aldehyde resin composite material is filled in the gap of the three-dimensional fluffy material to ensure that the phenolic aldehyde foam and the three-dimensional fluffy material become a whole and overcome the defects of poor toughness, low strength, easy dusting and easy pulverization of the conventional phenolic aldehyde foam material. The modified phenolic aldehyde foam plate has the advantages of excellent toughness, high strength, and has small possibility of dusting and pulverization.

Description

technical field [0001] The invention relates to a phenolic foam board, in particular to a modified phenolic foam board and its composite board and their manufacturing method. Background technique [0002] Phenolic foam materials in the prior art generally have defects such as poor toughness, easy pulverization, dust generation, and poor compressive strength, and when using it to produce composite panels with a composite surface layer, the surface layer material and the phenolic foam layer are bonded The strength is not enough. When the finished product is processed for secondary processing, the surface layer material and the phenolic foam layer are easy to peel off and separate, resulting in unreliable product quality. Contents of the invention [0003] The main purpose of the present invention is to overcome the shortcomings of poor toughness, easy pulverization, easy dusting, and poor compressive strength that phenolic foam materials in the prior art generally have, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B5/32B32B7/12B29C44/12B32B37/12E04F13/075
Inventor 戢超丘煊元詹仕凯
Owner 厦门高特高新材料有限公司
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