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Epoxy resin composition and flexible copper-clad plate prepared from same

A technology of epoxy resin and brominated epoxy resin, applied in the direction of epoxy resin glue, synthetic resin layered product, adhesive type, etc. , flexibility and peel strength decrease, etc., to achieve the effect of improving flexibility, excellent heat resistance, and excellent flexibility

Inactive Publication Date: 2011-07-20
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to improve the flexibility of the adhesive, the general practice is to increase the amount of nitrile rubber in the composition, however, the increase in the amount of nitrile rubber will cause the flame retardancy and heat resistance of the adhesive to decline; if by increasing the bromine content of the composition To improve the flame retardancy, it will cause the heat resistance, flexibility and peel strength of the adhesive to decrease

Method used

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  • Epoxy resin composition and flexible copper-clad plate prepared from same
  • Epoxy resin composition and flexible copper-clad plate prepared from same
  • Epoxy resin composition and flexible copper-clad plate prepared from same

Examples

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Effect test

preparation example Construction

[0054] The above composition is used for the preparation of flexible copper-clad laminates: the liquid dispersion of the composition of the present invention is formed by mixing the required components with an organic solvent, and the dispersion is coated on one or both sides of the poly On the imide film; the polyimide film coated with the dispersion is passed through an online drying oven, heated at 80-160°C for 2 to 8 minutes, thereby removing the organic solvent and drying the composition to form a semi-cured state containing The epoxy resin composition is coated, and then rolled and laminated with copper foil at 70-100°C, and the semi-cured composition is post-cured to obtain the final single-sided or double-sided flexible copper clad laminate. Post curing is preferably carried out at a temperature of 120-160°C.

[0055] The heat resistance, flame retardancy, peel strength and folding resistance of the above-mentioned flexible copper clad laminate were measured, and furth...

Embodiment 1

[0058] Brominated epoxy resin (trade name DER530-A80, manufactured by DOW Company, epoxy equivalent 425-440g / eq, solid content 80%) 51.3 parts by weight, brominated epoxy resin (trade name Epiclon153-60M, Dainippon Ink Co., Ltd. Made by the company, epoxy equivalent 390-410g / eq, solid content 60%) 38.3 parts by weight, rubber modified epoxy resin (trade name HyPox RF928, manufactured by U.S. CVC company, epoxy equivalent 200-225g / eq, rubber content 20 %) 10.0 parts by weight, carboxyl-terminated nitrile rubber (trade name Nipol 1072CGX, manufactured by U.S. ZEON company, solid content 100%) 26.0 parts by weight, highly flexible amine curing agent (trade name ELASMER-1000P, Japan Ihara Chemical Industry Co. , LTD.) 4.6 parts by weight, 4,4'diaminodiphenylsulfone 8.3 parts by weight, 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.25 parts by weight, aluminum hydroxide (trade name OL-104 / WE, manufactured by Albemarle, USA) 25.0 parts by weight; antioxidant (product model 101...

Embodiment 2

[0060] Brominated epoxy resin (trade name DER530-A80, manufactured by DOW Company, epoxy equivalent 425-440g / eq, solid content 80%) 51.3 parts by weight, brominated epoxy resin (trade name Epiclon153-60M, Dainippon Ink Co., Ltd. Made by the company, epoxy equivalent 390-410g / eq, solid content 60%) 38.3 parts by weight, rubber modified epoxy resin (trade name HyPox RF928, manufactured by U.S. CVC company, epoxy equivalent 200-225g / eq, rubber content 20 %) 10.0 parts by weight, carboxyl-terminated nitrile rubber (trade name Nipol 1072CGX, manufactured by U.S. ZEON company, solid content 100%) 26.0 parts by weight, highly flexible amine curing agent (trade name ELASMER-1000P, Japan Ihara Chemical Industry Co. , LTD.) 9.2 parts by weight, 4,4'diaminodiphenylsulfone 7.4 parts by weight, 1-cyanoethyl-2-ethyl-4-methylimidazole (2E4MZ-CN) 0.25 parts by weight, aluminum hydroxide (trade name OL-104 / WE, manufactured by Albemarle, USA) 25.0 parts by weight; antioxidant (product model 101...

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Abstract

The invention discloses an epoxy resin composition and a flexible copper-clad plate prepared from the same. The epoxy resin composition comprises brominated epoxy resin, rubber modified epoxy resin, butadiene-acrylonitrile rubber, a high-flexibility amine curing agent, an aromatic amine curing agent, a curing accelerator, an antioxidant, inorganic filler and an organic solvent. The flexible copper-clad plate prepared from the epoxy resin composition comprises a polyimide film, an epoxy resin composition coating coated on one or two faces of the polyimide film and a copper foil laminated on the epoxy resin composition coating. In the epoxy resin composition, the high-flexibility amine curing agent and the high-flexibility amine curing agent are taken as a composite curing system, so that the flexibility of the composition can be improved remarkably, the dosage of the butadiene-acrylonitrile rubber and the bromine content of the composition can be lowered, and the composition has high flexibility, flame retardance and heat resistance. The flexible copper-clad plate prepared from the composition has high heat resistance, peeling strength, dimensional stability, flexibility, folding endurance and processability.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to an epoxy resin composition and a flexible copper-clad board prepared by using the composition. Background technique [0002] Flexible copper clad laminate (FCCL) is a base material for flexible printed circuit boards. It has four major functions of electrical connection, insulation, mechanical support and flexibility. In recent years, the thinner and shorter electronic products have promoted flexible The rapid development of copper clad laminates. Flexible copper-clad laminates are divided into two categories: adhesive-type flexible copper-clad laminates and adhesive-free flexible copper-clad laminates. Adhesive-type flexible copper-clad laminates are formed by bonding copper foil and insulating base film with adhesives. At present, the commonly used adhesives It is a brominated epoxy resin composition, and the commonly used insulating base film is polyimide film. Flexibility, heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L13/00C08L9/02C08L63/00C08K13/02C08G59/56C08G59/60C09J163/02C09J113/00C09J109/02C09J163/00C09J11/06C09J11/08B32B15/092B32B27/08B32B27/28
Inventor 茹敬宏刘生鹏
Owner GUANGDONG SHENGYI SCI TECH
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