Tunneling field effect transistor and preparation method thereof
A tunneling field effect and transistor technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as leakage current rise and sacrifice device performance
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[0098] figure 2 is an embodiment of the first manufacturing method of the Tunneling Field Effect Transistor disclosed in the present invention, wherein figure 2 (a) is a cross-sectional view of the device along the channel length direction, figure 2 (b) is the top view of the device. The device has three electrodes in total: drain electrode D, gate electrode G and source electrode S, which is a three-terminal device. The device includes a first gate stack region, a second gate stack region, a first source region 201 , a second source region 203 , a drain region 202 and a substrate region 210 . Wherein, the first gate stack region includes a first insulating layer 204 and a first conductive layer 206 , and the second gate stack region includes a second insulating layer 205 and a second conductive layer 207 . The insulating film material used for the first insulating layer 204 and the second insulating layer 205 is silicon dioxide obtained by thermal oxidation growth or de...
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Abstract
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Application Information
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