Preparation method of CuI nanostructure
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- LUDONG UNIVERSITY
- Publication Date
- 2017-08-22
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to a preparation method of a CuI nanostructure, which belongs to the technical field of semiconductor materials. Background technique
[0002] CuI is a wide-bandgap semiconductor material with direct bandgap, the bandgap width is 3.1eV, and the exciton binding energy is as high as about 62meV. The CuI material has a high transmittance (80%) in the visible light region. Because CuI materials generally have excess iodide ions and cause copper vacancy defects, they exhibit p-type conductivity and high hole mobility (>40cm 2 V -1 the s -1 ). In addition, CuI has the advantages of non-toxicity, abundant reserves, and low cost. These advantages make CuI materials show broad application prospects in the fields of solar cells, photodetectors, photoelectric sensors, display devices and transparent conductive films.
[0003] At present, people have realized the preparation of CuI thin films and nanostructures by various methods, in...