Method for preparing phase-change copper alloy inner and outer radiating integrated piece for high-power light-emitting diode (LED)

A copper alloy, phase change technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of reduced luminous efficiency and luminous life, no phase change heat absorption, slow heat dissipation, etc., to achieve increased luminous efficiency, high The effect of developing application value and prolonging life

Inactive Publication Date: 2011-10-05
SHANDONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And these connectors do not have the function of phase change heat absorption
In addition, in the entire heat dissipation path, there are many devices and interfaces, the thermal resistance will be large, the heat dissipation will be slow, and the die temperature will be high, so the luminous efficiency and luminous life of the LED will be greatly reduced.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: A method for preparing a phase-change heat sink integrating a built-in heat dissipation pad and an external heat sink for a high-power LED, comprising the following steps:

[0022] The first step is to use a thermal analyzer to determine that the phase transition point of the copper alloy is 35°C;

[0023] In the second step, the geometric shape of the heat sink is designed as a cylinder with equal diameters at both ends;

[0024] The third step is to shape the heat sink by casting;

[0025] The fourth step is to put the heat sink processed in the third step into the heat treatment furnace, heat it to 830°C, and keep it warm for 20 minutes;

[0026] The fifth step is to take out the heat sink that has been heated and kept warm in the fourth step, and put it into boiling water at 100°C for 31 minutes;

[0027] The sixth step is to take the heat sink out of the boiling water and air cool to room temperature;

[0028] The seventh step is to polish the surf...

Embodiment 2

[0031] Embodiment 2: A method for preparing a phase-change heat sink integrating a built-in heat dissipation pad and an external heat sink for a high-power LED, comprising the following steps:

[0032] The first step is to use a thermal analyzer to determine that the phase transition point of the copper alloy is 40°C;

[0033] In the second step, the geometric shape of the heat sink can be designed as: two cylinders with unequal end diameters;

[0034] The third step is to shape the heat sink by casting;

[0035] The fourth step is to put the heat sink processed in the third step into the heat treatment furnace, heat it to 832°C, and keep it warm for 21 minutes;

[0036] The fifth step is to take out the heat sink that has been heated and kept warm in the fourth step, and put it into boiling water at 100°C for 32 minutes;

[0037] The sixth step is to take the heat sink out of the boiling water and air cool to room temperature;

[0038] The seventh step is to polish the sur...

Embodiment 3

[0041] Embodiment 3: A method for preparing a phase-change heat sink integrating a built-in heat dissipation pad and an external heat sink for high-power LEDs, comprising the following steps:

[0042] The first step is to use a thermal analyzer to determine that the phase transition point of the copper alloy is 45°C;

[0043] In the second step, the geometric shape of the heat sink is designed as: two prisms with equal end surface areas;

[0044] The third step is to shape the heat sink by casting;

[0045] The fourth step is to put the heat sink processed in the third step into the heat treatment furnace, heat it to 834 ° C, and keep it warm for 22;

[0046] The fifth step is to take out the heat sink that has been heated and kept warm in the fourth step, and put it into boiling water at 100°C for 33 minutes;

[0047] The sixth step is to take the heat sink out of the boiling water and air cool to room temperature;

[0048] The seventh step is to pickle the heat-treated co...

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PUM

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Abstract

The invention relates to a method for preparing a martensite phase transformation copper alloy inner and outer radiating integrated piece for a high-power light-emitting diode (LED). The method comprises the following steps of: 1, determining a martensite phase transformation of a copper alloy; 2, determining a geometric shape of a radiating piece, wherein the end of the radiating piece contacting a chip is named a radiating pad end, and the other end of the radiating piece is positioned outside the package and is named a radiator end; 3, machining the radiating piece for forming; 4, putting the radiating piece into a thermal treatment furnace, heating and performing heat preservation; 5, taking the radiating piece out and performing second-stage heat preservation; 6, taking the radiating piece out and cooling; and 7, performing surface treatment on the radiating piece. The preparation process is simple, the integrated piece is low in manufacturing cost and convenient to use, functions of a radiating pad, a printed board, a radiator and other devices in the prior art can be integrated, and the radiating path and thermal resistance are greatly reduced. Moreover, each gram of alloy can absorb 7 to 9 joules of heat, the radiating capacity is greatly improved, the service life is prolonged, and the luminous efficiency is improved. Therefore, the method is high in development and application value in practical application.

Description

technical field [0001] The invention relates to a preparation method of a heat dissipation part, in particular to a preparation method of a phase-change copper alloy internal and external heat dissipation integrated part for high-power LEDs. Background technique [0002] At present, high-power LED, as the fourth generation electric light source, is called "green lighting source". Since LED is a photoelectric device, only 15% to 20% of the electrical energy is converted into light during its operation, and the remaining 80% to 85% is converted into heat. If the heat is not discharged to the outside in a timely manner, the temperature of the LED crystal grain interface will be too high, which will seriously affect the luminous efficiency and luminous life. Therefore, in the design and use of high-power LEDs, how to dissipate heat is a big problem. The current heat dissipation solution is to place a large-sized copper heat dissipation pad under the die without phase change, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/64
Inventor 耿贵立
Owner SHANDONG UNIV
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