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Polyurethane pouring sealant as well as preparation method and pouring process thereof

A technology of potting glue and polyurethane, applied in the polymer field, can solve the problems of low viscosity and achieve the effect of long operation time, moderate hardness and smooth flow

Inactive Publication Date: 2011-10-12
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a polyurethane potting compound with the characteristics of low viscosity, long operating time and moderate hardness for the defects of the existing polyurethane potting compound.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Mix 300 parts by weight of two-terminal hydroxyl polyether polyol and 50 parts by weight of plasticizer dioctyl phthalate, place in a closed container, stir at a high speed at 100°C and vacuumize, and the operation time lasts for 1 hour. Cool down to 40°C for use; then add 45 parts by weight of diphenylmethane diisocyanate, 0.2 parts by weight of catalyst dibutyltin dilaurate, stir at a high speed at 25°C and vacuumize, wait for potting after 3 minutes When there is a small amount of exothermic heat and it is translucent, stop stirring to form a homogeneous liquid and obtain polyurethane potting glue. The polyurethane encapsulant prepared in this example has a low initial viscosity before curing, and the viscosity within 0.5 hours after compounding is ≤500 mPa·s (at room temperature), which is convenient for encapsulation.

Embodiment 2

[0030] Mix 340 parts by weight of three-terminal hydroxyl polyether polyol and 55 parts by weight of plasticizer dipentyl phthalate, place in a closed container, stir at a high speed at 110 ° C and vacuumize, and the operation time lasts for 2 hours. Cool down to 50°C for later use. Finally, add 55 parts by weight of hexamethylene diisocyanate and 0.05 parts by weight of the catalyst stannous octoate, stir at a high speed at 30°C and vacuumize. After 5 minutes, when the potting glue has a small amount of heat release and is translucent Stirring was stopped to form a homogeneous liquid to obtain a polyurethane potting compound. The polyurethane encapsulant prepared in this example has a low initial viscosity before curing, and the viscosity within 0.5 hours after compounding is ≤500 mPa·s (at room temperature), which is convenient for encapsulation.

Embodiment 3

[0032] Mix 280 parts by weight of polytetrahydrofuran polyol and 50 parts by weight of plasticizer dipropylene glycol phthalate, place in an airtight container, stir at a high speed at 130°C and vacuumize, the operation time lasts 3 hours, and cool down to 60°C ℃ for later use. Finally, add 45 parts by weight of xylylene dicyanate and 0.3 parts by weight of catalyst triethylenediamine, stir at a high speed at 35°C and vacuumize. After 10 minutes, the potting glue will emit a small amount of heat and show a When it is translucent, stop stirring to form a homogeneous liquid, and obtain polyurethane potting glue. The polyurethane encapsulant prepared in this example has a low initial viscosity before curing, and the viscosity within 0.5 hours after compounding is ≤500 mPa·s (at room temperature), which is convenient for encapsulation.

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Abstract

The invention relates to a polyurethane pouring sealant. The polyurethane pouring sealant comprises the following raw material components in parts by weight: 100-350 parts of polyether polyol, 40-70 parts of isocyanate, 20-60 parts of plasticizer and 0.01-0.5 parts of catalyst and is prepared by a method comprising the following steps: (a) mixing the polyether polyol with the plasticizer in the proportion and placing the mixture in a closed container, vacuuming for 1-3 hours while rotating at the temperature of 100-130 DEG C, and then cooling to 35-60 DGE C; and (b) mixing the isocyanate, the catalyst with the product prepared in the step (a) in the proportion and then placing the mixture in the closed container, stirring at high speed and vacuuming for 1-10 minutes, and stopping stirring when the pouring sealant releases a small amount of heat and is semitransparent. The polyurethane pouring sealant has excellent flowability and low viscosity, and is easer to penetrate to tiny apertures, thereby being beneficial to tight filling inside a poured material.

Description

technical field [0001] The invention relates to the field of polymers, in particular to a polymer adhesive. Background technique [0002] Potting, simply put, is an operation process that uses potting materials to reasonably arrange, assemble, connect, seal and protect the various components that make up the electronic device to prevent moisture, dust, etc. The intrusion of harmful gases to electronic components, slow down vibration, prevent external force damage and stabilize electronic component parameters. At present, there are three main categories of potting adhesives at home and abroad: epoxy resin, silicone and polyurethane. Among them, epoxy resin has good electrical insulation performance and high bonding strength, but has a large shrinkage rate. Silicone is resistant to high and low temperature. According to its crosslinking mechanism, it can be divided into two types: condensation type and addition type: the operation time of condensation type silicone is accept...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C09K3/10
Inventor 穆晗赵飞明王立峰
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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