Zinc oxide single crystal polishing technology for substrate of photoelectric device
A zinc oxide single crystal, zinc oxide technology, applied in the direction of grinding equipment, grinding machine tools, metal processing equipment, etc.
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[0033] The specific steps of the zinc oxide single crystal polishing method that can be used for optoelectronic device substrates provided by the present invention are as follows:
[0034] 1) Single crystal rough grinding: use 320~500 Cw sandpaper to artificially grind the surface of the cut zinc oxide single crystal with a thickness of about 1.0 mm, and the surface of the zinc oxide wafer has no saw marks;
[0035]2) Bonding plate: use 320~500 Cw sandpaper to chamfer the roughly ground zinc oxide wafer with a thickness of about 0.8 mm (see the attached figure 1 ), place the chamfered wafer on the platform of a temperature-controlled / cooled pressurized die bonder for heating, the heating temperature is 80-110 °C, and then use a heated special adhesive to apply it on the upper surface of the wafer while it is hot, and finally Use a cylindrical stainless steel press cake with a diameter of 9 cm to press on the wafer, and the pressure on the wafer is 100~200 g / cm 2 ; After 5 mi...
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