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Light emitting diode (LED) radiator and manufacturing method thereof

A technology of light-emitting diodes and heat sinks, which is applied to electrical components, circuits, semiconductor devices, etc., and can solve problems such as the inability to replace heat sinks

Inactive Publication Date: 2013-03-13
江苏丰创新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The application of graphite substrates in high-power LED lamps is only to replace aluminum substrates to improve thermal conductivity, and cannot replace heat sinks

Method used

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  • Light emitting diode (LED) radiator and manufacturing method thereof
  • Light emitting diode (LED) radiator and manufacturing method thereof
  • Light emitting diode (LED) radiator and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0078] (Embodiment 1, LED cooling device)

[0079] See figure 1 The light emitting diode cooling device of this embodiment includes a graphite film 1 , an insulating material layer 2 and a conductive circuit 3 distributed sequentially from bottom to top, and also includes an LED lamp bead 4 arranged on the graphite film 1 and electrically connected to the conductive circuit 3 .

[0080] Graphite film 1 adopts a pure carbon high thermal conductivity graphite film manufactured by Changzhou Tanyuan Technology Development Co., Ltd. The high thermal conductivity graphite film is a new type of film heat dissipation material completely different from the graphite base layer of the graphite substrate, and its thickness is 0.012 mm to 1.0 mm, preferably 0.012 mm to 0.15 mm. The thermal conductivity parameters of various types of products of a pure carbon high thermal conductivity graphite film from 0.012 to 0.1mm are shown in the following table:

[0081]

[0082] The thermal cond...

Embodiment 2

[0093] (Example 2, the manufacturing method of light-emitting diode cooling device)

[0094] In this embodiment, the manufactured LED heat sink is the LED heat sink with the structure described in Embodiment 1. Manufacturing the LED heat sink requires diaphragm cutting machines, copper foil cutting machines, stamping equipment, solder paste printing machines, SMT placement machines, reflow ovens, ultrasonic cleaning machines, magnifying glasses, microscopes, online testers and other testing equipment .

[0095] The manufacturing method of LED cooling device of the present invention comprises the following steps:

[0096] ① Use a diaphragm cutting machine to cut or use a stamping equipment to stamp the purchased high thermal conductivity graphite film material into a graphite film 1 of the desired shape.

[0097] ②Use the copper foil cutting machine to cut or use the stamping equipment to stamp the purchased copper foil material to make the copper foil conductive circuit 3 ac...

Embodiment 3

[0105] (Embodiment 3, the manufacturing method of light-emitting diode cooling device)

[0106] In this embodiment, the manufactured LED heat sink is the LED heat sink with the structure described in Embodiment 1. Manufacture of the LED cooling device requires a diaphragm cutting machine, a copper foil cutting machine, an insulating glue coating machine, a solder paste printing machine, an SMT placement machine, a reflow oven, an ultrasonic cleaning machine and a magnifying glass, a microscope, and an online tester And other testing equipment.

[0107] The manufacturing method of LED cooling device of the present invention comprises the following steps:

[0108] ① Use a diaphragm cutting machine to cut or use a stamping device to stamp the purchased high thermal conductivity graphite film material into a graphite film 1 of the desired shape.

[0109] ②According to the circuit design, use a protective film to cover the parts of the graphite film 1 that are not prepared to be ...

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Abstract

The invention discloses a light emitting diode (LED) radiator and a manufacturing method thereof. The radiator mainly comprises a graphite film, an LED lamp bead, a conductive circuit and an insulation material layer, wherein the graphite film is a high thermal conductivity graphite film; the conductive circuit is a copper foil or aluminum foil conductive circuit or a wire; the LED lamp bead is electrically connected with the conductive circuit so as to form corresponding LED light sources which are connected in series or in parallel; the conductive circuit is fixedly stuck on the insulation material layer when serving as the copper foil or aluminum foil conductive circuit; and the insulation material layer is fixedly stuck on the graphite film. The manufacturing method comprises the following steps of: cutting a graphite film material into required shapes; sticking a cut insulation material onto the graphite film; sticking the cut copper foil or aluminum foil conductive circuit onto the graphite film; fixedly and electrically connecting the pins of the LED lamp bead with the conductive circuit in a reflow welding or manual welding way; and cleaning, detecting and repairing. The radiator has a good heat radiating effect, and the LED lamp bead has long service life.

Description

technical field [0001] The invention relates to a heat dissipation device and a manufacturing method thereof, in particular to a heat dissipation device of a light emitting diode and a manufacturing method thereof. Background technique [0002] A light emitting diode (LED) is a semiconductor device that converts electrical energy into visible light. Due to its advantages of high luminous efficiency, low power consumption, and long life, it is more and more used in various occasions that need light. Lamps composed of light-emitting diodes are widely used in homes, shopping malls, banks, hospitals, hotels, and restaurants. And so on various occasions. The basic structure of high-power LED lamps currently on the market (high-power LED lamps refer to a single LED lamp bead with a power of 1 watt or more) is to fix a circuit board with welded or mounted LED lamp beads on a heat sink. On the chip, the above-mentioned circuit board is an aluminum substrate, graphite substrate or ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/64H01L33/00
Inventor 孙伟峰
Owner 江苏丰创新材料有限公司