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Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED)

A silicone, functionalized technology, applied in conductive adhesives, adhesives, epoxy resins, etc., can solve the problems of small chip thrust and poor adhesion of conductive adhesives

Active Publication Date: 2011-12-21
上海本诺电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the polarity of the main chain of polysiloxane is small, the above-mentioned conductive adhesive has poor adhesion, and the thrust of the chip is relatively small, and the thrust of the small piece at room temperature is <5 Kgf / die (2×2 mm)

Method used

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  • Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED)
  • Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED)
  • Epoxy functionalized organosilicon conductive adhesive for light emitting diode (LED)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] The epoxy-functionalized silicone conductive adhesive for LEDs of this embodiment comprises components with the following parts by weight:

[0074] SiMAET n=1 10 SiMDH n=1 8.0 2E4MZ 0.5 silver powder 80 Z6040 0.5

[0075] After testing, the epoxy functional silicone conductive adhesive for LEDs in this embodiment has a refractive index of 1.43, a glass transition temperature of 98°C, a 2 mm × 2 mm chip thrust of 7.0 Kgf (25°C), and a conductivity of 3.0 × 10 -4 W. cm.

Embodiment 2~6

[0077] The components (parts by weight) and properties of the epoxy-functionalized silicone conductive adhesives for LEDs in Examples 2-6 are shown in Table 1. The refractive index is 1.45-1.50, and the glass transition temperature is 104-132°C. The thrust force of the mm × 2 mm chip is 7.6~11.3 Kgf (25°C), and the conductivity is 1.0× 10 -4 ~3.0 × 10 -4 W. cm.

Embodiment 7~12

[0079] The components (parts by weight) and properties of the epoxy-functionalized silicone conductive adhesives for LEDs in Examples 7-12 are shown in Table 2. The refractive index is 1.43, the glass transition temperature is 29-98°C, 2 mm × The thrust force of 2 mm chips is 5.4~7 Kgf (25℃), and the conductivity is 1.0×10 -4 ~3.0 × 10 -4 W. cm.

[0080] Table 1 Components and properties of Examples 2 to 6

[0081]

[0082] Components and properties of Table 2 Examples 7-12

[0083]

[0084] Table 3 Components and properties of Examples 13 to 18

[0085]

[0086] Components and properties of Table 4 Examples 19 to 24

[0087]

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Abstract

The invention discloses an epoxy functionalized organosilicon conductive adhesive for an LED. The organosilicon conductive adhesive comprises 10 to 20 weight parts of organosilicon epoxy resin, 7 to 20 weight parts of organosilicon curing agent, 0.1 to 0.5 weight part of curing accelerator, 70 to 90 weight parts of silver powder conductive filler and 0.1 to 0.5 weight part of silane coupling agent serving as an interface reinforcing agent. The conductive adhesive can be stored at a low temperature for more than 6 months, and the viscosity is increased by 25 percent at room temperature for more than 48 hours. After the adhesive is cured, the thermal decomposition temperature (2 percent mass loss) is 300 DEG C, the small piece thrust at room temperature is 5Kgf / die(2*2mm), and the volume resistivity is less than or equal to 3.0*10<-4>W.cm; and the adhesive has high conductivity, heat resistance and ultraviolet (UV) resistance.

Description

technical field [0001] The invention relates to an LED organic silicon conductive adhesive, in particular to an epoxy functionalized organic silicon conductive adhesive. Background technique [0002] With the development of high-power LEDs, customers have put forward higher and higher requirements for the materials used in the packaging process. New materials must not only meet the customer's production process requirements, but also put forward new requirements for the UV resistance and heat resistance of the materials. new challenge. [0003] The conductive adhesive used to fix high-power LED chips directly affects the optical performance and reliability of the final product. The requirements of high-power LEDs for conductive silver adhesives are high electrical conductivity, high thermal conductivity and high shear strength. The traditional epoxy conductive adhesive has excellent bonding performance, but the epoxy resin matrix is ​​often not resistant to UV. Under the co...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J9/02H01L33/56
Inventor 黄健翔
Owner 上海本诺电子材料有限公司
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